FUJIFILM Electronic Materials U.S.A. is heading into SEMICON West 2026 with a clear focus on greener chemistries and localized production.
Taking the floor a t SEMICON West in San Francisco from October 13-15, the company will spotlight its newly developed PFAS-free products, including negative-type immersion ArF resists and polybenzoxazole (PBO). The shift toward PFAS-free materials comes as a direct response to stricter environmental standards and growing customer demand for sustainable fab operations.
Alongside its eco-friendly push, Fujifilm is heavily targeting the booming advanced packaging sector. The company will showcase its ZEMATES™ family of photoresistive insulating films, as well as its latest chemical mechanical planarization (CMP) materials, which are critical for the precise wafer planarization required in leading-edge nodes.
Visit FUJIFILM Electronic Materials at SEMICON West, booth #2049, October 13-15, 2026.
The exhibition comes at a pivotal time for Fujifilm’s U.S. strategy. With semiconductor demand surging, the company is actively expanding production capacity across its four domestic manufacturing hubs in Arizona, Colorado, Rhode Island, and Texas. By anchoring production and technical support locally, Fujifilm aims to give U.S. chipmakers a stable, reliable pipeline of critical materials without the friction of overseas logistics.
Positioning itself as a “one-stop solution” for advanced semiconductor manufacturing, the company’s broader portfolio spans nearly every stage of the fabrication process, from photoresists and image sensor materials to ultra-pure solvents, cleaners, and thin-film systems.
Attendees looking to discuss localized supply chains and next-generation packaging materials can connect with the Fujifilm team in the South Hall at booth #2049.
Leadership Comment
“Driven by growing demand for AI, advanced computing, and data-intensive applications, the semiconductor industry continues to invest heavily in both manufacturing capacity and next-generation process technologies,” said Brian O’Donnelly, president & CEO, FUJIFILM Electronic Materials U.S.A., Inc. and corporate vice president, FUJIFILM Corporation. “This growth is fueling demand for high-performance materials across the semiconductor manufacturing process.”
