The collaboration aims to guarantee memory subsystems fulfill the highest requirements for performance and functional safety, which is one of the most important issues in safety-driven industries, by fusing Quintauris Platform reference architectures and real-time platforms with Everspin’s tested MRAM solutions.
In order to integrate cutting-edge memory technologies into the Quintauris ecosystem, Quintauris and Everspin Technologies established a strategic partnership. The partnership intends to improve the safety and reliability of RISC-V-based systems, especially for edge, industrial, and automotive applications where security, low latency, data durability, and integrity are crucial.
The collaboration aims to guarantee memory subsystems fulfill the highest requirements for performance and functional safety, which is one of the most important issues in safety-driven industries, by fusing Quintauris Platform reference architectures and real-time platforms with Everspin’s tested MRAM solutions.
Quintauris’ goal of making RISC-V commercially ready for automotive programs is closely aligned with Everspin’s strong commitment to the automotive market, which goes beyond technology and includes appropriate certifications, manufacturing excellence, long-term supply, and continuous quality improvement.
Leadership Comments
“Everspin’s leadership in MRAM and their track record of over 200 million products deployed make them a strong addition to our ecosystem,” said Pedro Lopez, Market Strategy Officer at Quintauris. “Together, we are closing the gap between innovation and dependability, enabling RISC-V to be confidently adopted in next-generation automotive programs.”
“RISC-V is opening new doors in safety-critical computing, but it also demands memory that can match its performance and reliability,” said David Schrenk, VP Business Development at Everspin Technologies. “By integrating our MRAM into the Quintauris platform, we’re helping developers build systems that retain data integrity under power loss, radiation or extreme temperatures, without compromising speed or security. This partnership strengthens the foundation for scalable, dependable platforms that will shape the future of automotive electronics.”
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