50pc Higher Performance Than Standard SSO8 Package

Infineon Technologies introduces the SSO10T TSC package with OptiMOS™ MOSFET technology. With its direct top-side cooling concept, the SSO10T TSC package offers excellent thermal performance.

The New SSO10T TSC Package Offers:

• Eliminates heat transfer into or through the PCB of the automotive electronic control unit.
• A simple and compact double-sided PCB design.
• Minimizes cooling requirements and system costs for future automotive power designs.
• The SSO10T TSC has a 5 x 7 mm² footprint.
• Based on the established industry standard SSO8, a 5 x 6 mm² robust housing.
• Due to its top-side cooling, the SSO10 TSC offers more than 20 percent and up to 50 percent higher performance than the standard SSO8 – depending on the thermal interface (TIM) material used and the TIM thickness.
• The SSO10T TSC package is JEDEC listed for open market and provides wide second source compatibility.
• The package can be introduced quickly and easily as the future standard for top-side cooling.

The SSO10T package enables a very compact PCB design and reduces the system footprint. It also lowers the cost of the cooling design by eliminating vias, resulting in lower overall system costs and design effort. At the same time, the housing offers high power density and efficiency, thus supporting the development of future-proof and sustainable vehicles.

Key Applications

The SSO10T TSC is therefore well suited for applications such as electric power steering (EPS), EMB, power distribution, brushless DC drives (BLDC), safety switches, reverse battery, and DCDC converters.

Availability

The first 40 V automotive MOSFET products with SSO10T are now available: IAUCN04S6N007T, IAUCN04S6N009T, IAUCN04S6N013T, IAUCN04S6N017T. Further information is available at https://www.infineon.com/cms/en/product/promopages/SSO10T/.

Infineon at Embedded World

Embedded World will take place from 9 to 11 April, 2024 in Nuremberg, Germany. Infineon will present its products and solutions for decarbonization and digitalization in hall 4A, booth #138 and virtually. Company representatives will also hold several TechTalks as well as presentations at the accompanying Embedded World Conference, followed by discussions with the speakers.