MacDermid Alpha Electronics Solutions to have supported Shenzhen Moker’s installation of Affinity Flex. This deployment of a cyanide-free Electroless-Nickel-Immersion-Gold (ENIG) process marks an important step forward for flexible printed circuit board (FPCB) manufacturing in China.
The new capability strengthens the flex and rigid-flex PCB segment in the region, helping fabricators tackle reliability issues while meeting rising environmental, health, and safety expectations.
As flex-PCB designs move toward thinner constructions, higher circuit density, and more demanding bend requirements, traditional electroless nickel finishes can introduce risks such as cracking, copper damage, and open-circuit failures.
At the same time, manufacturers face growing pressure from customers and regulators to reduce hazardous chemistries and improve EH&S performance.
Affinity Flex was developed specifically to address these challenges. Its advanced electroless-nickel technology delivers improved flex reliability thanks to a unique columnar grain structure, enabling it to meet the demanding performance needs of modern flex applications while staying within IPC guidelines for ENIG finishes.
In addition to reliability, Affinity Flex supports safer and more sustainable production. As a cyanide?free technology, it reduces energy consumption and lowers waste generation without sacrificing throughput or cost efficiency.
The installation at Shenzhen Moker completed in October 2025 includes a cyanide-free immersion-gold formulation that creates a safer working environment, cuts chemical usage, and reduces power demand.
Overall, the project reflects a shared commitment between MacDermid Alpha and Shenzhen Moker to advance safer, more sustainable manufacturing practices without compromising performance in the flex-PCB space.
Key Comments
Mr. Lin Denghuan from Shenzhen Moker commented: “For Moker, the introduction of the cyanide-free flexible ENIG process line supports the rapidly growing customer demand in the high-reliability flexible PCB and rigid-flex PCB sectors. The process’s overall performance in solderability, wire-bonding reliability, and process stability makes it highly suitable for end markets requiring extremely high levels of quality and consistency, including automotive electronics, AI smart devices, telecommunications, and other mission-critical electronic applications.”
Mr. Lin continued, “Our experience working with MacDermid Alpha to establish the Affinity Flex process has been very positive. Their expertise and technical know-how accelerated the setup and helped us overcome technical challenges smoothly. We not only gained a reliable surface finishing process but also strengthened the trust of our customers and end-device manufacturers (OEMs).”
“Cyanide-based gold processes have been a long-standing concern for flex manufacturers balancing performance with EH&S compliance,” said YK Choong, Asia Product Manager for Final Finishes at MacDermid Alpha. “This installation proves that high-reliability ENIG can be achieved without compromising safety, sustainability, or cost of ownership.”
“As we continue to expand our technology leadership in the flex and rigid-flex market, partnerships with valued customers like Shenzhen Moker are essential,” said Dr. Frank Xu, Director, Final Finish Line of Business, at MacDermid Alpha. “Their adoption of Affinity Flex reflects the growing demand for advanced, reliable, and environmentally conscious final finish solutions.”
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