Renesas Electronics has unveiled the RA0 microcontroller (MCU) Series, which is powered by the Arm Cortex-M23 processor. These cost-effective RA0 devices boast the lowest power consumption in the industry among general purpose 32-bit MCUs. 
The RA0 devices have a current consumption of 84.3?A/MHz in active mode and 0.82 mA in sleep mode.
Moreover, Renesas provides a Software Standby mode in the latest MCUs, which decreases power usage by an additional 99 percent to just 0.2 µA. Paired with a rapid wake-up High-speed On-Chip Oscillator (HOCO), these highly efficient MCUs present a perfect solution for various applications such as battery-operated consumer electronics, small appliances, industrial system control, and building automation.
Feature Set Optimized for Low Cost
Renesas has commenced the shipment of the initial batch in the RA0 Series, specifically the RA0E1 Group. These products are tailored to meet the requirements of cost-sensitive applications.
With an operating voltage range spanning from 1.6V to 5.5V, customers are relieved from the need for a level shifter/regulator in 5V systems.
The RA0 MCUs come equipped with timers, serial communications, analog functions, safety functions, and HMI functionality, all aimed at reducing the overall BOM cost for customers. Furthermore, a variety of packaging options are available, including a compact 3mm x 3mm 16-lead QFN package.
Moreover, the new MCU features a high-precision (±1.0%) on-chip oscillator (HOCO) that enhances baud rate accuracy, eliminating the necessity for a standalone oscillator. Unlike conventional HOCOs, this oscillator maintains its precision across a wide temperature range from -40°C to 105°C.
This extended temperature range allows customers to bypass expensive and time-consuming “trimming” procedures, even post-reflow process.
The RA0E1 MCUs include critical diagnostic safety functions as well as an IEC60730 self-test library. They also offer security features including true random number generator (TRNG) and AES libraries for IoT applications, including encryption.
“As the leader in embedded processing, our customers expect Renesas to provide the best solution for any application,” said Akihiro Kuroda, Vice President of the Embedded Processing 2nd Division at Renesas. “The RA0E1 Group MCUs deliver the ultra-low power and low cost needed for price-sensitive systems without sacrificing safety, data security and ease-of-design. Coupled with the recent introduction of the high-performance RA8 Series, Renesas now offers the premier MCU solution for any customer application anywhere in the world.”
“Power-constrained IoT embedded applications addressing markets such as industrial and smart home have specific performance, efficiency and security needs,” said Paul Williamson, senior vice president and general manager, IoT Line of Business at Arm. “Renesas’ RA MCU Family, built on Arm technology, now offers solutions ranging from low power RA0 MCUs to the high performance AI-capable RA8 devices, all with a common design environment that enables easy and fast development and migration.”
Key Features of the RA0E1 Group MCUs
- Core: 32MHz Arm Cortex-M23
- Memory: Up to 64KB integrated Code Flash memory and 12KB SRAM
- Analog Peripherals:12-bit ADC, temperature sensor, internal reference voltage
- Communications Peripherals: 3 UARTs, 1 Async UART, 3 Simplified SPIs, 1 IIC, 3 Simplified IICs
- Safety: SRAM parity check, invalid memory access detection, frequency detection, A/D test, immutable storage, CRC calculator, register write protection
- Security: Unique ID, TRNG, Flash read protection
- Packages: 16-, 24- and 32-lead QFNs, 20-pin LSSOP, 32-pin LQFP
FSP Package in new RA0E1 Group MCUs
The new RA0E1 Group MCUs are supported by Renesas’ Flexible Software Package (FSP). The FSP enables faster application development by providing all the infrastructure software needed, including multiple RTOS, BSP, peripheral drivers, middleware, connectivity, networking, and security stacks as well as reference software to build complex AI, motor control and cloud solutions.
It allows customers to integrate their own legacy code and choice of RTOS with FSP, thus providing full flexibility in application development. Using the FSP will ease migration of RA0E1 designs to larger RA devices if customers wish to do so.
Winning Combinations
Renesas has combined the new RA0E1 Group MCUs with numerous compatible devices from its portfolio to offer a wide array of Winning Combinations, including the HVAC Environment Monitor Module for Public Buildings. Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly. They can be found at renesas.com/win.
Demonstration at embedded world 2024
To see a live demonstration of the new RA0 MCUs, join Renesas at embedded world 2024 in Nuremberg, Germany, April 9-11 in Hall 1, Stand 234.
Availability
The RA0E1 Group MCUs are available now, along with the FSP software and the RA0E1 Fast Prototyping Board. Samples and kits can be ordered either on the Renesas website or through distributors. More information on the new MCUs is available at renesas.com/RA0E1.
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