In order to cooperate on the development of Fixed Wireless Access (“FWA”) technology, GCT Semiconductor Holding has announced that it has signed a memorandum of understanding (“MOU”) with a tier one worldwide infrastructure and terminal provider (the “Tier One Supplier”).
GCT’s 5G solutions are modem chipset and RFIC, will be used in this project. Before the end of 2024, the company hopes to finalize a definitive agreement.
The development cooperation on fixed wireless access devices using GCT’s 5G chipsets is included in the agreement with the global Tier One supplier.
With the signing of the MOU, GCT and this Tier One Supplier will now collaborate on the development of exclusive features for FWA devices as well as 5G chipsets. The Company anticipates that in the second half of 2025, FWA devices relevant to this activity will begin to be launched.
Key Comments
“With the continued 5G network expansion around the globe, there is a strong demand for faster and high-performing FWA technology and 5G devices,” said John Schlaefer, CEO of GCT. “We are excited to continue our relationship with this key customer and look forward to working closely together as they roll out their 5G offering with GCT chipsets in 2025.”
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