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ELECTRONICS

Tessolve Ties Up with Intel Foundry for Advanced EMIB Packaging

Tessolve has partnered with Intel Foundry to support advanced package design like EMIB chiplet packaging. Embedded Multi-die Interconnect Bridge (EMIB) has become a key technology...

China’s CXMT Enters ETF Spotlight, Challenging Global Memory Giants

Tema ETFs has added ChangXin Memory Technologies (CXMT) to its Tema Memory ETF (DISK) as a top holding, assigning it a 10.56% portfolio weight....

Catena-X Opens Secure Data Highway for EU-China Auto Trade

Catena-X Automotive Network e.V., in partnership with the China Association of Automobile Manufacturers (CAAM) and VDA China, has launched what it describes as the...

NVIDIA, Silvaco Alliance Targets Faster Chip Simulation

Silvaco Group and NVIDIA to push digital twins for semiconductor design and manufacturing to the next level. The companies announced a collaboration that combines...

The evolution of edge AI: a path to smarter, sustainable technology

Artificial Intelligence (AI) is becoming a transformative force shaping our everyday lives. From wearable devices that monitor our health in real time to autonomous...

DOES EVERY AI DEVICE HAVE TO BE CONNECTED TO THE CLOUD?

Just a few years ago, most applications using artificial intelligence were based on a simple operating scheme. Data from sensors went to a server...

Magnachip Moves into HV SiC with Navitas

Navitas Semiconductor and Magnachip Semiconductor have struck a strategic partnership aimed at speeding up SiC adoption in high-voltage and ultra-high-voltage power markets. Under the agreement,...

Palomino Sends First MicroLED Prototypes to Hyperscaler

Palomino Laboratories has shipped its first-generation MicroLED light engine prototypes to its first hyperscaler customer, marking an early milestone for the company’s optical interconnect...

BYD Adopts DTS AutoStage as Exclusive In-Car Media Platform

BYD has chosen DTS AutoStage™ as its exclusive in-car media platform, bringing a more connected audio and video experience to future vehicles for BYD...

TVP Exclusive – How ST is Moving From “Eyes and Depth” to “Pictures and Perception”

Sitting in STMicroelectronics’ recent IMG media briefing, one theme came through immediately that the company no longer sees its imaging devices as simple cameras,...

Littelfuse Unveils FlatSuppressX TVS Diodes Targeting 48V Auto Systems

Littelfuse has introduced the TP5.0SMD-FL and TP1KSMB-FL Series FlatSuppressX™ TVS Diodes, expanding its portfolio of transient voltage suppression devices for 48 V automotive electronics....

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