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TVP BUREAU

TVP Bureau is The Volt Post’s internal Editorial Team, dedicated to providing in-depth coverage of the Tech B2B ecosystem. The team is tasked with tracking the latest trends and developments across the tech industry, with a strong focus on emerging technologies and innovations. They are responsible for creating insightful editorial content, managing event coverage, and conducting research on new breakthroughs shaping the industry. TVP Bureau also plays a key role in ensuring that The Volt Post remains a trusted resource by staying ahead of the curve in reporting real-time news, views, and strategic industry insights

Exclusive Content

HMS Networks to Host Virtual Engineering Day on CAN XL and Automotive Ethernet

HMS Networks is dedicating October 28 to the nuts...

Microchip Expands L-Series with 50-krad Rad-Tolerant, Ultra-Compact LX-820 Oscillator

Microchip Technology has expanded its L-Series timing lineup with...

Inertial Labs Launches NVIDIA-Powered INS-NV Navigation Platform

Inertial Labs, a VIAVI company, has launched the INS-NV,...

Matching Signal and Power Connectors to Robotic and Other High-Density Industrial Applications

- Barley Li, Applications Engineering Manager – Technical Content,...

Renesas Debuts Flagship 600MHz MCUs with Embedded MRAM

Renesas has officially leveled up its MCU lineup with...

Infineon Names 2026 Humanoid Robotics Champions

After four months of intensive development and mentoring, the...

Bosch Bets on Humanoid Robots to Offset Auto Sector Decline

Bosch eyes robotics as its core auto parts business faces growing pressure. The German industrial giant said it will expand its push into humanoid robotics,...

Autodesk Bets on India with Self Serve Digital Store Expansion

Autodesk expands India Store - rolled out a major update to the Autodesk Store in India, turning it into a fully self serve procurement...

Qorvo Targets Advanced AESA Systems with New X Band Module

Qorvo has introduced a new X band radar front end solution designed to help defense system engineers push performance further without adding size, weight,...

A New Standard Power Module Package Built For 3-Level Circuits

Mitsubishi Electric and Semikron Danfoss have jointly developed a new standard power module package built for 3-level circuits, targeting industrial drives and renewable energy...

Teradyne and TEL Launch KGD Test Cell for AI Chips

Integrated KGD Test Cell, UltraFLEXplus with Prexa SDP for AI, data center 2.5D/3D package manufacturing yield. Teradyne and Tokyo Electron (TEL) to deliver an integrated...

NXP’S New Radar SoC Democratizes Advanced ADAS for EVs

NXP Semiconductors announced the SAF8444, a new Automotive Radar SoC with an innovative RF design that delivers high performance while keeping power consumption low. This...

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