Tokyo Electron Unveils Prexa SDP for High-Heat Singulated-Device Testing
Tokyo Electron has launched Prexa™ SDP, a new device prober built for testing singulated devices. The system is aimed at a fast-growing challenge in advanced...
How Infineon is Growing India Footprint Via OSATs, Tech Transfer – An Inside Story!
Infineon expands semiconductor ecosystem in India as it doubles down its presence across the potentially growing indigeneous semiconductor ecosystem. Over the past few years,...
onsemi and Geely Team Up on 900V EVs Built on EliteSiC
onsemi and Geely Auto Group have deepened their strategic partnership to fast-track next-generation electric and hybrid vehicle development.
onsemi and Geely collaboration centers on tighter...
Skyworks Si86Px Integrates Power and Isolation in One Compact IC
Skyworks has introduced its Si86Px family of digital isolators with integrated power, a compact, all-in-one solution that combines high-performance signal isolation with an isolated...
OTC Unveils 180-Layer, 15 mm PCB for AI HBM Test Equipment
OKI Circuit Technology, the OKI Group’s printed circuit board (PCB) business unit, has developed new design and production technologies for 180-layer PCB which is...
Kyocera Launches Ceramic Core Substrate for AI xPUs, 2.5D Packaging
Kyocera Corporation has announced the commercialization of a new multilayer ceramic core substrate tailored for advanced semiconductor packages, including xPUs and switch ASICs that...