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TVP Bureau is The Volt Post’s internal Editorial Team, dedicated to providing in-depth coverage of the Tech B2B ecosystem. The team is tasked with tracking the latest trends and developments across the tech industry, with a strong focus on emerging technologies and innovations. They are responsible for creating insightful editorial content, managing event coverage, and conducting research on new breakthroughs shaping the industry. TVP Bureau also plays a key role in ensuring that The Volt Post remains a trusted resource by staying ahead of the curve in reporting real-time news, views, and strategic industry insights

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Pickering Launches gRPC Remote Gateway for Distributed PXI Testing

ADVANCE TESTING TVP BUREAU - 0
Pickering Interfaces has changed how engineers handle remote instrument...

VIAVI Adds Model Context Protocol to NITRO AI for Conversational Network Validation

ADVANCE TESTING VOLT TEAM - 0
VIAVI is bringing natural-language processing directly to the test...

Exxelia Readies Rugged Capacitors and Stator Manufacturing Tech for electronica 2026

ELECTRONICS TVP BUREAU - 0
Exxelia will exhibit at the upcoming Electronica 2026 trade...

DigiKey Heads to Hackaday Supercon 2026 to Support Open Source Hardware Developers

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DigiKey is heading to Pasadena this November as a...

CONTACT Open World Highlights the Shift to Live Industrial AI on the Shop Floor

VOLT IN TVP BUREAU - 0
At this year’s CONTACT Open World in Bonn, the...

Panasonic Industry Europe Targets Deep Space Hardware at Space Tech Expo 2026

VOLT IN VOLT TEAM - 0
When Space Tech Expo 2026 kicks off in Bremen...
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L&T Semiconductor Forays into Cellular IoT Module Market

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L&T Semiconductor Technologies has entered the cellular IoT module market with a pre-certified 4G module powered by a Qualcomm chipset, targeting smart devices across...
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Cadence Launches Chiplet Ecosystem at CES 2026 Spurs Physical AI Innovation

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Cadence unveils partner ecosystem at CES 2026 to fast-track chiplet-based physical AI systems. The initiative targets data centers, HPC, and edge devices like robots...
ELECTRONICS

NXP UCODE X Redefines RAIN RFID with Ultra-Low Power

TVP BUREAU -
The new UCODE X from NXP Semiconductors offers the lowest power consumption, flexible configurations, and industry-leading read and write sensitivity. A variety of new,...
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olee.space Achieves 20km 10Gbps Laser Link with 85pc Indian Tech

TVP BUREAU -
The successful demonstration of a 20 km, 10 Gbps wireless laser communication system developed primarily with domestic components was announced by olee.space. The system...
ELECTRONICS

Microchip Enhances NVIDIA DGX Spark with Custom MEC1723 EC Firmware

TVP BUREAU -
The firmware for Microchip Technology's MEC1723 Embedded Controller (EC) has been developed specifically to support NVIDIA DGX Spark personal AI supercomputers. The software is...
ELECTRONICS

Allegro Expands SiC Gate Driver Line With New Power-Thru Chipset

TVP BUREAU -
New AHV85003/AHV85043 chipset joins the flagship AHV85311 integrated solution with industry’s first complete family of noise-eliminating, self-powered SiC gate drivers. With the release of the...
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