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TVP Bureau is The Volt Post’s internal Editorial Team, dedicated to providing in-depth coverage of the Tech B2B ecosystem. The team is tasked with tracking the latest trends and developments across the tech industry, with a strong focus on emerging technologies and innovations. They are responsible for creating insightful editorial content, managing event coverage, and conducting research on new breakthroughs shaping the industry. TVP Bureau also plays a key role in ensuring that The Volt Post remains a trusted resource by staying ahead of the curve in reporting real-time news, views, and strategic industry insights

Exclusive Content

TI Breaks EV Current-Sensing Trade-Off With First Multiaxial Coreless Hall Sensor

ELECTRONICS TVP BUREAU - 0
Texas Instruments (TI) has introduced what it says is...

Taiwan Expo USA 2026 Set to Drive New Taiwan-U.S. Tech and Manufacturing

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Taiwan Expo USA 2026 will return to Dallas this...

Baya Systems Expands into Japan to Accelerate AI Chip Design With WeaveIP Fabric

AI/ML VOLT TEAM - 0
Baya Systems is stepping up its presence in Japan,...

SEMI Taiwan Launches Chip Materials Alliance to Shore Up Local Supply Chains

VOLT IN TVP BUREAU - 0
SEMI Taiwan has rolled out a new semiconductor materials...

GaN power transistors: What 700 V and 100 V PowerGaN bring to power-supply design

ELECTRONICS VOLT TEAM - 0
Power designs now face the same demands at the...

Critical Manufacturing, UST To Scale MES, AI-driven Mfg Across Southeast Asia

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Critical Manufacturing taps UST to scale MES rollouts across...
ELECTRONICS

ST Advances Physical AI with Record-Size MCU AI Model Zoo

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To speed up the prototyping and development of embedded AI systems, STMicroelectronics has released new models and improved project support for its STM32 AI...
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Broadcom Validate Future-Proof Wi-Fi 8 Testing with R&S CMP180

TVP BUREAU -
Broadcom has validated that Rohde & Schwarz's CMP180 radio communication tester is a complete, future-proof testing solution for upcoming Wi-Fi 8 devices. This partnership ensures...
ELECTRONICS

OKI Advances Multilayer PCB Simulation

TVP BUREAU -
In order to enable precise control of via characteristics in 1.6 Tbps-class high-speed transmission PCBs that support next-generation AI data centers, the OKI Group's PCB...
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Schneider Electric, AVEVA, ETAP Join OpenUSD Alliance

TVP BUREAU -
AVEVA, ETAP, and Schneider Electric announced that they had joined the Alliance for OpenUSD (Universal Scene Description). The companies are helping to shape the...
ELECTRONICS

Panasonic Launches Compact 3N Tactile Switch with IP67 Protection

TVP BUREAU -
A new compact tactile switch with a new operation force of 3 N and a distinct tactile feel has been introduced by Panasonic Industry...
ELECTRONICS

Ethernet-APL Field Switch Enhances Real-Time Plant Visibility, Maintenance

TVP BUREAU -
Pepperl+Fuchs is expanding its Ethernet-APL portfolio with the latest version of the FieldConnex Ethernet-APL Field Switch, shown at SPS 2025. The switch is designed...
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