OMNIVISION Unveils High-Res LCOS for Smart Glasses
For next-generation smart glasses, OMNIVISION introduced a single-chip liquid crystal on silicon (LCOS) small panel with ultra-low power. The OP03021 LCOS panel offers a 1632...
Is the AI Chip Race Threatened by Grid Collapse?
The AI Chip Boom is projected to drive the market from $203 billion in 2025 to $565 billion by 2032, creates unprecedented challenges in supply...
Is Kioxia’s Latest Breakthrough Ready For High-Density AI DRAM
The development of highly stackable oxide-semiconductor channel transistors, which would make high-density, low-power 3D DRAM feasible by Kioxia Corporation. This technology, which was introduced at...
MIKROE Launches CAN-LIN SBC Click for Dual Protocol Communication
CAN-LIN SBC Click is a new Click board communication interface by MIKROE. Developers can quickly develop proof-of-concept, prototype, and code new embedded solutions with...
Anritsu, HEAD Acoustics Enable Next-Gen eCall Voice Quality Evaluation
In partnership with HEAD Acoustics, ANRITSU CORPORATION announced the release of an advanced acoustic evaluation solution for next-generation vehicle emergency call systems ("NG eCall").
Faster and...
GlobalFoundries Names Sam Franklin as New Chief Financial Officer
Sam Franklin has been named Chief Financial Officer by the Board of Directors of GlobalFoundries (GF), with immediate effect. Prior to his current position...