Rohde & Schwarz Highlights Advanced T&M at Embedded World
The company will highlight a wide range of advanced test solutions designed to help engineers boost energy efficiency, accelerate EMC compliance, speed up digital...
Synopsys Powers AI Era with New HAV Platforms
Synopsys has announced new advancements across its hardware-assisted verification (HAV) portfolio, introducing fresh platforms and capabilities designed to meet the surging demand for AI...
ROHM SiC High-Efficiency Modules HSDIP20, DOT-247 Begins Online Sales
ROHM has begun online sales of new SiC molded modules: TRCDRIVE pack™, HSDIP20 and DOT-247. Amid growing concerns over tightening global power supply and...
SIMCom New SIM8666/68 – Tiny AI Powerhouses for Imaging
SIMCom just announced two new smart AI modules, the SIM8666 and SIM8668 seriesthat make it dead simple to add AI-powered imaging to all sorts of applications.
These are SIMCom’s...
Panasonic FineX Sets New Standard in Transparent EMI Shielding
Panasonic Industry has introduced FineX (“FineCross”), a new generation of transparent conductive film designed to deliver high-performance electromagnetic wave shielding in advanced display, industrial,...
MIKROE Clicker 4 Unleashes Renesas RA4M2 Power
MIKROE has unveiled the Clicker 4 for R7FA4M2AD3CFP - a compact, affordable dev board that's ready to prototype right out of the box.
Powered by Renesas' R7FA4M2AD3CFP...