DigiKey Packs Q1 2026 with 31,000 Fast-Ship NPIs
DigiKey in Q1 2026 expands inventory with nearly 31,000 new stocking products available for fast shipment, giving engineers, designers, makers, and procurement teams quicker...
ROHM Unveils NFC Wireless Charging IC for Smart Rings
ROHM has unveiled a new wireless power supply IC chipset tailored for ultra-compact wearables and accessories, pairing the receiver ML7670 with the transmitter ML7671. The chipset...
Microchip Boosts Hydrogen Maser Production with New Alabama Facility
Microchip Technology is scaling up production of its hydrogen maser systems as global demand for ultra-precise timekeeping continues to grow. The company has opened...
KYOCERA AVX to Showcase High-Reliability Passives at CMSE 2026
KYOCERA AVX at CMSE - the 29th annual Components for Military & Space Electronics (CMSE) Conference & Exhibition, taking place in Los Angeles from...
MIKROE mikroSDK 2.17.12 Adds Renesas RA2E1 Support
MIKROE has announced that the latest release of its mikroSDK software development kit now supports the Renesas RA2E1 family of low-power Arm Cortex-M23 MCUs. These devices...
Infineon and Valeo Showcase LBS Ground Projection at AutoChina 2026
Infineon and Valeo are working together on a short-distance ground projection module that uses Laser Beam Scanning (LBS). Their first joint innovation is being...