Greenliant’s Rugged Industrial SSDs at embedded world 2026
Greenliant will showcase its latest lineup of industrial SSDs at embedded world 2026 in Nuremberg, Germany (March 10–12), at hall 2, booth 647.
Built for mission-critical...
Rohde & Schwarz, Realtek Validate Bluetooth LE HDT
Rohde & Schwarz and Realtek Semiconductors have successfully validated the industry’s first test solution for the upcoming Bluetooth® LE High Data Throughput (HDT) feature.
The...
Renesas Names Malini and Yvonne to Lead India and China Businesses
Effective March 1, 2026, Malini Narayanamoorthi has been appointed Vice President and President of Renesas Electronics India. She previously served as India Country Manager...
ROHM, Suchi Semicon Forge Strategic Chip Manufacturing Pact in India
ROHM and Suchi Semicon just announced a strategic partnership to boost semiconductor production right here in India. Together, they’re blending ROHM’s world-class device tech...
Teledyne FLIR Launches Lepton XDS Dual Thermal Camera
Teledyne FLIR OEM Introduces Lepton XDS Dual Thermal and Visible Camera Module.
Teledyne FLIR OEM has unveiled the Lepton XDS, a compact dual thermal and...
Infineon Brings AI-Ready MCUs, XENSIV Sensors to embedded world 2026
At embedded world 2026, Infineon will highlight its XENSIV sensor portfolio and demonstrate how advanced sensor data underpins advanced automotive, industrial, and consumer applications.
Next-generation...