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VOLT TEAM

The Volt Team is The Volt Post’s internal Editorial and Social Media Team. Primarily the team’s stint is to track the current development of the Tech B2B ecosystem. It is also responsible for checking the pulse of the emerging tech sectors and featuring real-time News, Views and Vantages.

Exclusive Content

proteanTecs and MegaChips Partner on Next-Generation ASIC Monitoring

proteanTecs and MegaChips is collaborating to bring embedded silicon...

Maxscend Expands Into Optical Interconnects Business

Maxscend Technologies is expanding beyond its core RF chip...

TENIX Battery Additive Targets Degradation in Manganese-Rich Cathodes

Ten-Nine Technologies is scaling production of its patented cathode...

Marelli, Microchip Advance Open Display Connectivity

Marelli and Microchip Technology have unveiled a new solution...

Baya Systems, AdoreSys to Advance Chip Design Across Asia-Pacific

Baya Systems and AdoreSys have announced a strategic partnership...

Indium Showcases Durafuse, Advanced Solder Pastes at Productronica India 2026

Indium Corporation will showcase its portfolio of high-performance solder...

Spirent B3 800G Appliance for AI/ML Tech at OFC

The Spirent B3 800G Appliance was first witnessed during the 2024 OFC Conference and Exhibition in San Diego, March 26-28 in booth #1515. Spirent Communications...

Fastest EV on Earth at Vicor Powering Innovation Podcast

The latest episode of the Vicor Powering Innovation podcast was announced in collaboration with Lightning Motorcycles. "Richard Hatfield sits down with David Krakauer, VP of...

Renesas Commercializes RISC-V Multimarket MCUs

Industry’s first general-purpose 32-bit RISC-V-based microcontrollers (MCUs) by Renesas is built with an internally developed CPU core. To advance the development of RISC-V products,...

Infineon Next-Gen MCUs, Semiconductors at embedded world 2024

During the upcoming embedded world 2024 in Nuremberg, Infineon Technologies under the motto "Driving decarbonization and digitalization. Together." to showcase new possibilities mingling decarbonization...

R&S to ‘Embed’ Testing Future at embedded world

To showcase future innovation in the embedded industry, Rohde & Schwarz announces its participation in the embedded world Exhibition & Conference. At this year's...

50pc Higher Performance Than Standard SSO8 Package

Infineon Technologies introduces the SSO10T TSC package with OptiMOS™ MOSFET technology. With its direct top-side cooling concept, the SSO10T TSC package offers excellent thermal...

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