Compact High Heat Dissipation Design Sets a New Standard for OBCs
ROHM has developed new 4-in-1 and 6-in-1 SiC molded modules in HSDIP20 package that are optimized for PFC and LLC converters in onboard chargers...
104 New Suppliers, 98,320 Innovative NPIs Added By DigiKey in Q1 2025
DigiKey in Q1 2025 announced an increase in its extensive product selection. This includes 104 new suppliers and 98,320 innovative new product introductions (NPIs) in...
Spirit Electronics Acquires SMART Microsystems to Expand U.S. Semi Capacity
As part of its strategic commitment to developing domestic semiconductor production, Spirit Electronics has acquired SMART Microsystems, which is based at Lorain County Community...
Mouser Bags 2024 Americas Titan Award for Digital POS by ams OSRAM
Mouser Electronics announces that it has received the 2024 Americas Titan Award for Digital POS by ams OSRAM, a global leader in sensing, illumination, and visualization solutions.
Mouser's...
Discover ‘Planet Navitas’ SiC, GaN Future at PCIM 2025
Visit the "Planet Navitas" booth (Hall 9, Booth #544) to discover about Navitas' aim to 'Electrify our World™' by advancing the transition from legacy...
Cadence DDR5 12.8 Gbps MRDIMM Gen2 Memory IP on TSMC N3 Process
Cadence introduced the first DDR5 12.8 Gbps MRDIMM Gen2 memory IP system based on the TSMC N3 process, addressing the requirement for increased memory...