Xscape AI Infrastructure Limits: Scaling AI Beyond Compute
The AI revolution promises to transform everything, but it won’t. At least, not unless data center fabric networks transform first.
?As the capability of agentic...
Big Tech Taps UCLA for $125M Hub to Reinvent AI Semiconductors
Broadcom, Applied Materials, GlobalFoundries, Meta Platforms and Synopsys are teaming up with the UCLA Samueli School of Engineering on a new $125 million Semiconductor...
Ericsson Opens 10 ITI Labs for 5G Infrastructure Training in India
Aligning with the Indian government’s digitalization push, Ericsson and TSSC have launched the Ericsson ITI Labs Project to equip 10,000 Industrial Training Institute (ITI)...
Asahi Kasei Launches PSPI Film to Advance Panel-Level Packaging
The PSPI film can be used in redistribution layers and as insulating material for package substrates.
Panel-level packaging is quickly gaining traction across the semiconductor...
Comminent, Silicon Labs Deliver 500,000 Wi-SUN Modules for India’s Smart Grid
Comminent’s Wi-SUN modules are powered by Silicon Labs’ EFR32FG28 Wireless SoC, a platform purpose-built for large-scale smart grid and industrial IoT networks.
Comminent, an innovator...
EEPROM at 40 Years: A Popular, Proven Technology Anticipating Developers Memory Needs
EEPROM is a mature NVM technology with important properties for today’s cutting-edge applications. Sylvain Fidelis, Multi-market Business Line Director, Connected Security at STMicroelectronics, the...