izmo Microsystems has signed a Memorandum of Understanding (MoU) with two European photonics innovators, CCRAFT SA of Switzerland and Alcyon Photonics SL of Spain.
The strategic partnership aims to jointly design, manufacture, and commercialize advanced photonic integrated circuit (PIC) solutions for datacom, telecom, aerospace, and sensing applications.
This collaboration brings together three specialized players from different segments of the photonics value chain. CCRAFT, a spin-out from the Swiss Centre for Electronics and Microtechnology (CSEM), operates an ISO-certified 150 mm thin-film lithium niobate (TFLN) foundry and is among the few companies globally capable of mass-producing TFLN photonic chips.
These chips enable ultra-high-speed electro-optic modulators exceeding 400 Gbit/s.
Madrid-based Alcyon Photonics contributes its expertise in ready-to-fabricate photonic IP design, offering validated architecture libraries that accelerate the shift from prototype to high-volume manufacturing.
izmomicro complements this with its advanced semiconductor packaging and co-packaged optics capabilities, often described as the “last mile” of photonics commercialization.
The company recently became the first in India to demonstrate a complete silicon photonics packaging process, spanning design, simulation, optical alignment, fiber attach, hermetic sealing, and full system-level testing.
Operating from its Class 1000 cleanroom in Bangalore, izmomicro provides leading-edge solutions in 3D die stacking, flip-chip assembly, fine-pitch wire bonding, and co-packaged optics. These capabilities are in global demand and position India as a credible participant in the rapidly growing silicon photonics supply chain.
Silicon photonics has become a core enabler of the AI-driven economy. Industry reports value the global market at around USD 2–3 billion in 2025, with growth projected at 25–30% CAGR reaching up to USD 22 billion by the early 2030s and potentially exceeding USD 28 billion by 2034.
Data centers and high-performance computing currently account for over 70% of global demand, driven by the shift to 400G, 800G, and 1.6T optical interconnects as copper approaches its physical limits.
Beyond data centers, silicon photonics is also accelerating advancements in 5G/6G, quantum computing, LiDAR, and satellite communications. TFLN technology, in particular, delivers superior modulation bandwidth, lower drive voltages, and broad wavelength operation making it an ideal platform for next-generation AI and quantum interconnects.
Under the MoU, the three companies will work together to deliver Alcyon’s photonic IP libraries to customers, jointly design and produce new photonic systems, and commercialize the resulting solutions.
izmomicro will serve as the preferred packaging partner, contributing design guidelines to ensure PIC designs are optimized for advanced packaging from the earliest stages.
The collaboration also strengthens izmomicro’s position within Europe’s advanced photonics landscape, particularly as the European Chips Act recognizes photonics as a strategic growth area.
By linking CCRAFT’s foundry in Switzerland and Alcyon’s design expertise in Spain with India’s fast-growing semiconductor manufacturing and packaging ecosystem, izmo Microsystems is helping forge a powerful India-Europe technology bridge, one that aligns perfectly with the spirit of India’s Aatmanirbhar Bharat semiconductor initiative.
Leadership Comment
Commenting on the partnership, Dinanath Soni, Director of izmo Microsystems, said: “Silicon photonics is the foundation of the next era of AI and data communication. By combining CCRAFT’s world-class TFLN foundry, Alcyon’s proven photonic IP, and our advanced packaging infrastructure in India, we’re building a truly end-to-end photonics value chain. This collaboration strengthens our engagement with Europe’s photonics ecosystem and opens exciting commercial opportunities across data communications, telecom, aerospace, and quantum technologies.”
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