In order to complete an end-to-end turnkey ASIC program from Netlist to packaged silicon, MosChip Technologies reported the successful silicon bring-up of SAC’s custom SoC in a 28nm technology node.
MosChip designed the substrate for the 10 Layer FC-CBGA package and assembly following tape out employing its proven Netlist to GDSII flow and methodology. It also validated engineering samples on ATE, confirming functionality against specification.
The program is a prime example of MosChip’s integrated Turnkey ASIC capability, asserted its official release. Every critical phase was overseen by MosChip, including DFT architecture, DFT implementation and verification, full-chip physical design and signoff, RDL design and routing, package design, tester board design, and post-silicon bring-up and validation.
This reduced interface risk between phases, compressed timelines, and ensured cohesive execution across silicon, packaging, and test. SAC may now move on to the next phase of productization since packaged silicon has been delivered and validated.
With a multidisciplinary expertise in satellite technology and space-borne applications, the Space Applications Centre (SAC) is a top research and development institution under the Indian Space Research Organization (ISRO).
Serving both domestic and international stakeholders, SAC is a premier center of excellence that specializes in the design and development of innovative satellite systems for earth observation, communication, navigation, and scientific research.
SAC keeps advancing space science and applications for the societal benefit with its outstanding facilities and technological innovation.
Leadership Comments
“We are proud to have delivered this critical program. This milestone validates MosChip’s turnkey Netlist-to-Silicon capability and our commitment to single-owner accountability from design intent to validated silicon. By unifying design, implementation, packaging, and ATE validation, we help customers move from Spec/RTL to silicon with predictable schedules and first-pass silicon success,” said Srinivasa Rao Kakumanu, CEO & MD, MosChip Technologies.
