Chiplet Summit will also feature exhibits from industry leaders including Synopsys, Alphawave Semi, Teradyne, Cadence, Keysight, Siemens EDA, and Marvell, with more than 1,500 attendees expected.
Pre-registration for Chiplet Summit’s fourth annual event, which will take place at the Santa Clara Convention Center from February 17–19, is now open. For outstanding performance, major chipmakers have all embraced chiplets, and the Chiplet Summit unites the engineers and companies influencing integration’s future.
To Register and Secure Your Spot: CLICK HERE
The tools, methods, and platforms influencing chiplet-based systems are the main topics of the timely and useful instructional programs offered at Chiplet Summit. Attendees will learn about high-bandwidth memory (HBM), innovative packaging, and ways to speed up heterogeneous integration and testing—education not available at any other event.
Synopsys, Alphawave Semi, Arm, Cadence, Siemens, Marvell, UCIe Consortium, and the Open Compute Project (OCP) will give keynote addresses that explore trends and future directions in processors, communications devices, and AI chips for core and edge applications.
Chiplet Summit will also feature exhibits from industry leaders including Synopsys, Alphawave Semi, Teradyne, Cadence, Keysight, Siemens EDA, and Marvell, with more than 1,500 attendees expected.
Leadership Comments
“In 2026, we expect to see the full impact of chiplets,” said Chuck Sobey, Summit General Chair. “They are ideal for AI accelerators that require huge advances in throughput, power consumption, and latency.”
