EVAROS, a batch thermal processing system for 300 mm wafers, has been released by Tokyo Electron.
Deposition systems with advanced control capabilities are becoming more and more necessary as the development of complex 3D-structured semiconductor devices advances. Both increased chip production efficiency and better power-saving performance are necessary for environmental benefits.
TEL is introducing a next-generation batch thermal processing equipment with great productivity and sophisticated capabilities to address these demands.
EVAROS is more capable than our earlier 300 mm wafer versions, processing up to 200 wafers at once. The technology provides higher productivity due to its enhanced wafer transfer speeds.
A newly designed multi-zone control heater with improved dynamic fidelity, response, and stability characteristics is part of the thermal control unit, an essential part of a batch thermal processing system. This greatly shortens the time required to raise, drop, or stabilize the temperature and guarantees superb heating uniformity.
Large-diameter exhaust duct adoption has resulted in remarkable conductance*1 characteristics, allowing for the high quality and precision of deposition control needed for ALD*2 and other procedures used to make cutting-edge devices.
The method reduces the use of utilities, such as gas, electricity, and cooling water, which has a positive environmental impact. Consequently, compared to the preceding TELINDY PLUS, it generates about 25% fewer CO2 emissions per wafer. The automated position adjustment capability of the wafer carrier expedites system installation and makes maintenance easier. Furthermore, numerous independent functions will be supported in the future by the recently released system controller.
Leadership Comments
“EVAROS™ represents a major evolution in batch thermal processing systems, a field where we have cultivated basic technologies for many years,” said Shigeki Nakatani, Vice President & General Manager, TFF BU. “The system provides superior productivity and environmental performance for ALD and other deposition processes that require precise control. We will continue to advance our technologies and expand our application processes to meet the diverse needs of our customers.”
