Microchip Technology, announced that they have entered into a strategic collaboration to design a comprehensive non-volatile memory (NVM) chiplet package to ease customer adoption of modular, multi-die systems.
Chiplet technology is becoming more and more popular in the semiconductor industry as traditional monolithic chip designs become more difficult and expensive. Deca Technologies and Silicon Storage Technology (SST), a subsidiary of Microchip Technology, announced that they have entered into a strategic collaboration to design a comprehensive non-volatile memory (NVM) chiplet package to ease customer adoption of modular, multi-die systems.
Through this partnership, SST’s industry-leading SuperFlash embedded flash technology is combined with Deca’s M-Series fan-out and Adaptive Patterning technologies. The companies are using their knowledge of system-level integration to provide a packaged solution that enables clients to create, test, and market NVM chiplets.
Compared to typical monolithic integration, the method offers both technical and commercial advantages by allowing for greater architectural flexibility.
By integrating the capabilities of both businesses, the cooperative solution offers a memory-centric, modular basis for sophisticated multi-die designs.
The chiplet package makes use of SST’s SuperFlash technology in addition to the physical design components and interface logic needed to operate as a standalone chiplet.
This is combined with production routes via Deca’s network of certified partners, simulation flows, test plans, and redistribution layer (RDL) design guidelines based on adaptive patterning.
Deca and SST will work together to help customers from early design through certification and prototype manufacture, building on this basis.
The companies hope to facilitate wider adoption of heterogeneous integration by expediting design cycles and simplifying integration. They will also interact with clients worldwide to introduce chiplet solutions to the market.
Chiplet technology allows for a more-than-Moore approach, which has major benefits for semiconductor design and manufacturing. Designers may create better functionality and performance and launch products more quickly by going beyond traditional scaling.
Chiplets enable the mixing of sophisticated process nodes with less costly legacy geometries and permit the reuse of existing intellectual property.
Chiplets are a flexible, effective, and cost-effective technique to drive semiconductor innovation by employing the die technology that is most suited for a given function.
Leadership Comments
“Chiplet integration is reshaping how the industry thinks about performance, scalability and time to market,” said Robin Davis, VP of Strategic Engagements & Applications at Deca. “Our partnership with SST empowers customers to develop a chiplet solution that combines different chips, process nodes, sizes and even die from multiple foundries delivering more efficient and cost-effective products.”
“As our customers push the boundaries of Moore’s Law, they are expressing greater interest in chiplet- based solutions,” said Mark Reiten, Vice President of Microchip’s licensing business unit. “This partnership aims to deliver a comprehensive package of IP, simulation tools and advanced assembly and engineering services necessary for successful chiplet development and productization.”
Pricing and Availability
Customers interested in SST’s SuperFlash technology should access the SST website or contact a regional SST sales executive for more information and details of our NVM chiplet solutions. Those interested in Deca’s technology and offerings should visit the Deca website or reach out to Deca’s marketing contact.
