Infineon Technologies is releasing the EasyPACK CoolGaN Transistor 650 V module, which adds to its expanding GaN power portfolio.
The EasyPACK CoolGaN Transistor 650 V module, built on the Easy Power Module platform, was designed primarily for high-power applications such as data centers, renewable energy systems, and DC electric vehicle charging stations.
It is intended to fulfill the increased demand for higher performance while delivering optimum ease of use, allowing customers to accelerate their design processes and shorten time-to-market.
The EasyPACK CoolGaN Module Integrates:
- 650 V CoolGaN power semiconductors with low parasitic inductances,
- Achieved through compact die packing,
- Enabling fast and efficient switching.
- Delivers up to 70?kW per phase with just a single module,
- The design supports compact and scalable high-power systems,
- Combines Infineon’s .XT interconnect technology with CoolGaN options,
- The module enhances both performance and reliability.
The .XT technology is implemented on a high-performance substrate, significantly reducing thermal resistance, which in turn translates to higher system efficiency and lower cooling demands. This results in increased power density and excellent cycling robustness, even under demanding operating conditions.
Rise of AI Data Centers
Global electricity demand is predicted to rise as AI data centers expand rapidly, electric car usage increases, and global digitalization and reindustrialization trends continue.
Leadership Comments
“The CoolGaN-based EasyPACK power modules combine Infineon’s expertise in power semiconductors and power modules,” says Roland Ott, Senior Vice President and Head of the Green Energy Modules and Systems Business Unit at Infineon. “This combination offers customers a solution that meets the increasing demand for high-performance and energy-efficient technologies in applications such as data centers, renewable energy, and EV charging.”
Key Applications
With support for a broad range of topologies and customization options, the EasyPACK CoolGaN module addresses diverse requirements in industrial and energy applications.
Availability
Infineon will showcase the EasyPACK modules with CoolGaN at PCIM 2025 in Nuremberg at the Infineon booth in Hall 7, Booth 470.
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