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ELECTRONICS

NeoCortec Rolls Out White Paper on NeoMesh Over LoRa® for Massive IoT

NeoCortec has published a new white paper detailing how its NeoMesh protocol operates over LoRa® modulation as the physical layer and what that combination...

Skylark GNSS Comes to MIKROE’s GNSS 19 Click

Through a new partnership with Swift Navigation, a precise positioning technology major, MIKROE is bringing Swift’s Skylark® Precise Positioning Service to its GNSS 19...

Toshiba Ramps Up Compact Cortex-M4 MCUs for Single-Motor Control

Toshiba Electronic Devices & Storage Corporation has begun mass production of its TXZ+ Family Entry-Class M4L Group, a new series of compact motor-control microcontrollers...

Eliyan Hits $1B Valuation with $145M AI Interconnect Bet

Eliyan Corporation has raised $145 million in an oversubscribed Series C funding round, reaching a $1 billion valuation as it looks to scale its...

New Guide on Precision Wafer Processing with Diamond Technology

Hyperion Materials & Technologies has introduced a new practical guide, Diamond Solutions for Semiconductors, aimed at helping chipmakers navigate the growing complexities of advanced...

Enphase Energy Publishes White Paper on Kestrel ASIC

Enphase Energy has released a new technical white paper detailing its latest custom silicon platform, the “Enphase Kestrel ASIC,” a purpose-built chip designed to...

Danisense Launches DP12IP High-Precision Current Transducer

Danisense has introduced a new high-precision current transducer, the DP12IP, aimed at enabling accurate isolated DC and AC current measurement in demanding PCB-mounted power...

Kingston with STEIGER DYNAMICS to Power AI-Ready Systems

Kingston Technology Company has announced a partnership with system builder STEIGER DYNAMICS to supply memory for its custom-built systems, which range from high-performance creator...

Tessolve Ties Up with Intel Foundry for Advanced EMIB Packaging

Tessolve has partnered with Intel Foundry to support advanced package design like EMIB chiplet packaging. Embedded Multi-die Interconnect Bridge (EMIB) has become a key technology...

China’s CXMT Enters ETF Spotlight, Challenging Global Memory Giants

Tema ETFs has added ChangXin Memory Technologies (CXMT) to its Tema Memory ETF (DISK) as a top holding, assigning it a 10.56% portfolio weight....

Catena-X Opens Secure Data Highway for EU-China Auto Trade

Catena-X Automotive Network e.V., in partnership with the China Association of Automobile Manufacturers (CAAM) and VDA China, has launched what it describes as the...

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