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TVP BUREAU

TVP Bureau is The Volt Post’s internal Editorial Team, dedicated to providing in-depth coverage of the Tech B2B ecosystem. The team is tasked with tracking the latest trends and developments across the tech industry, with a strong focus on emerging technologies and innovations. They are responsible for creating insightful editorial content, managing event coverage, and conducting research on new breakthroughs shaping the industry. TVP Bureau also plays a key role in ensuring that The Volt Post remains a trusted resource by staying ahead of the curve in reporting real-time news, views, and strategic industry insights

Exclusive Content

Kia India Launches Mumbai Training Hub to Upskill Next-Gen Auto Workforce

Kia India and the Automotive Skills Development Council (ASDC)...

DigiKey Exclusively Launches Google-Powered Coralboard for Edge AI

DigiKey is now the exclusive global distributor for the...

Teledyne FLIR Brings AI-Powered Emissions Detection to CEM Asia 2026

Teledyne FLIR is heading to Kuala Lumpur for CEM...

NORD DRIVESYSTEMS Meets the Reporting Obligations of the Cyber Resilience Act

Drive specialist NORD DRIVESYSTEMS implemented the processes and structures...

Inside PLM.AI: Mercedes-Benz’s €500 Million Bet on AI-Driven Engineering

Mercedes-Benz is overhauling its engineering ecosystem with PLM.AI, a...

TME Accelerates IoT Design with Nordic-Powered Raytac BLE Modules

TME (Transfer Multisort Elektronik) has just added Raytac’s versatile...

Zephyr Project Secures Platinum Commitments From TI and Infineon

Texas Instruments (TI) and Infineon Technologies are deepening their investments in the open-source embedded landscape, officially upgrading their memberships in the Zephyr Project to...

TakeMe2Space Launches Orbital AI Infrastructure with SpaceX Rideshare Mission

TakeMe2Space is getting ready to deploy its MOI-1A satellite aboard SpaceX’s Transporter-18 rideshare mission on October 2, moving edge computing straight into Earth's orbit. Equipped...

Broadcom-Toppan JV Opens Singapore Fab to Clear AI Substrate Bottlenecks

In a targeted strike against the production bottlenecks stalling the artificial intelligence sector, US chipmaker Broadcom and Japanese manufacturing giant Toppan Holdings have launched...

Teledyne FLIR Secures Industry-First UL 2684 Listing for Thermal Fire Detection Cameras

Teledyne FLIR has landed an industry-first UL 2684 listing for its A40 and A70 (Axx-Series) thermal imaging cameras, officially clearing the hardware for use...

BOS Semiconductors Joins Arm Ecosystem to Scale Custom Silicon for Physical AI

BOS Semiconductors has joined the Arm Total Design for Physical AI ecosystem. Through its participation, BOS Semiconductors plans to expand its technology and business...

Resonac Targets 4x Die Yield Boost with Ultra-Large Wafer Format

The two-decade reign of the 300mm silicon wafer might be coming to an abrupt end, and Japan is positioning itself to own the next...

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