IBM, Lam Research Target Sub-1nm AI Chip Era
IBM and Lam Research are teaming up on a major five-year research push to crack sub-1nm logic chip tech, zeroing in on High-NA EUV...
R&M Posts Double-Digit Asia Growth Despite Core Market Decline
R&M has wrapped up a strategically pivotal year, using 2025’s leadership changes as a chance to reassess its positioning and long-term direction.
Regional performance
R&M saw sharp regional...
MacDermid Alpha Unveils Integrated Materials at Productronica China
MacDermid Alpha Electronics Solutions will showcase its integrated materials platform at Productronica China 2026 (March 25–27, Shanghai New International Expo Center). The company will demonstrate how coordinated, system-level materials...
Push-X in the TME offer – tool-free wiring of the new generation
XT series connectors with Push-X technology from Phoenix Contact set a new standard for quick and convenient wiring in industrial installations. The solution available at TME...
VIAVI Unveils 1.6T Test Platform to Power Next-Gen AI Networks
VIAVI Solutions has launched its next-generation TestCenter D2 1.6T Appliance, built to help cloud providers, hyperscalers, “neoclouds,” and network equipment makers accelerate the rollout of 1.6T...
From Columbia Labs, Xscape’s $37Mn Redundant Photonics Push
Xscape Photonics just raised another $37 million, pushing their total Series A to $81 million. Addition led this latest round, with continued backing from...