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TVP BUREAU

TVP Bureau is The Volt Post’s internal Editorial Team, dedicated to providing in-depth coverage of the Tech B2B ecosystem. The team is tasked with tracking the latest trends and developments across the tech industry, with a strong focus on emerging technologies and innovations. They are responsible for creating insightful editorial content, managing event coverage, and conducting research on new breakthroughs shaping the industry. TVP Bureau also plays a key role in ensuring that The Volt Post remains a trusted resource by staying ahead of the curve in reporting real-time news, views, and strategic industry insights

Exclusive Content

Murata Breaks Tradition, Partners with HanWool for MLCC Equipment

HanWool Semiconductor, a specialist in electronic component inspection equipment,...

drivebuddyAI Wins Indian Patent for Lane Detection Tech

drivebuddyAI has officially received an Indian patent for its...

Industrial Ethernet Hits 79% as Fieldbus Declines in 2026

HMS Networks has just released its annual industrial network...

Win Semiconductors Unleashes Powerful New GaN Process for 40V Operation

Win Semiconductors has officially qualified its NP12-0B process for...

Murata First Company to Offer Passive Component Simulation Models

Murata Manufacturing has announced a new collaboration with Synopsys...

Renesas Strengthens Renesas 365 with Pictorus Acquisition

Renesas Electronics has announced that one of its subsidiaries...

Alchip 3DIC Platform Enables Multi-Tbps AI Stacks

As AI processor design moves from the chip level to the system level, Alchip Technologies is betting that its 3DIC platform will become a...

NXP Expands India Blueprint with Proposed Mohali Hub

NXP Semiconductors is eyeing Mohali, Punjab as a potential new R&D hub in India, as part of its broader bet on the country’s semiconductor...

Toray Unveils Release-Liner-Free Fabric Adhesive Film

Toray Industries has developed a fabric adhesive film whose design selectively eliminates the need for a release liner (see note 1). Micron-level protrusions on...

Airengy Eyes €51M Solar, Storage and Wind Platform in Poland

Airengy has announced it has signed documents to examine a series of transactions in the Polish market totaling around €51 million across solar energy,...

STMicroelectronics Unveils Next-Gen ST64UWB UWB Chips

STMicroelectronics expands its ultra-wideband focus as the company launches its ST64UWB family. It is said to be the first fully integrated UWB solution that...

Has Google Inked A Deal With Marvell For Next-Gen AI Inference Chips?

Google is quietly rewriting its AI hardware playbook by opening discussions with Marvell Technology to co-develop a new generation of AI Inference Chips -...

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