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TVP Bureau is The Volt Post’s internal Editorial Team, dedicated to providing in-depth coverage of the Tech B2B ecosystem. The team is tasked with tracking the latest trends and developments across the tech industry, with a strong focus on emerging technologies and innovations. They are responsible for creating insightful editorial content, managing event coverage, and conducting research on new breakthroughs shaping the industry. TVP Bureau also plays a key role in ensuring that The Volt Post remains a trusted resource by staying ahead of the curve in reporting real-time news, views, and strategic industry insights

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Thread Group, Broadband Forum Join Forces to Streamline IoT Connectivity

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The Thread Group, an industry alliance representing more than...

onsemi Unveils Industry-First SiC Pairing Studio for Faster Power Design

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onsemi has introduced the Elite Pairing Studio, an online...

ROHM Launches Compact 80V MOSFETs for 48V Automotive Systems

ELECTRONICS TVP BUREAU - 0
ROHM has introduced the AG16xFNxx Series, a new lineup of...

Agile Analog, Xiphera Combine Anti-Tamper, PQC for Chip Security

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Agile Analog has teamed up with Xiphera, the expert...

Tenstorrent’s Acquistion by Qualcomm Will Be Talent over Technology

VOLT IN VOLT TEAM - 0
Qualcomm is reportedly in serious talks to buy Tenstorrent,...

Microchip Expands Nantes Facility with QML Class Y Certification

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Microchip Technology has expanded the certification scope of its Nantes...
ELECTRIC VEHICLES

onsemi and Geely Team Up on 900V EVs Built on EliteSiC

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onsemi and Geely Auto Group have deepened their strategic partnership to fast-track next-generation electric and hybrid vehicle development. onsemi and Geely collaboration centers on tighter...
ELECTRONICS

Skyworks Si86Px Integrates Power and Isolation in One Compact IC

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Skyworks has introduced its Si86Px family of digital isolators with integrated power, a compact, all-in-one solution that combines high-performance signal isolation with an isolated...
ELECTRONICS

OTC Unveils 180-Layer, 15 mm PCB for AI HBM Test Equipment

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OKI Circuit Technology, the OKI Group’s printed circuit board (PCB) business unit, has developed new design and production technologies for 180-layer PCB which is...
ELECTRONICS

Kyocera Launches Ceramic Core Substrate for AI xPUs, 2.5D Packaging

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Kyocera Corporation has announced the commercialization of a new multilayer ceramic core substrate tailored for advanced semiconductor packages, including xPUs and switch ASICs that...
VOLT IN

Can Cisco’s New Quantum Switch Connect Multi-Vendor Networks?

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Cisco has moved one of the most critical blocks toward a practical quantum network as the company recently unveiled the Cisco Universal Quantum Switch....
VOLT IN

VIAVI Announces Major Investment in PCIe 7.0 Protocol Test Platform

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Designed to deliver deep, actionable insights, the new Xgig PCIe 7.0 platform builds on the Xgig Software Suite with Trace Control, Expert, and Serialytics. VIAVI...
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