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TVP BUREAU

TVP Bureau is The Volt Post’s internal Editorial Team, dedicated to providing in-depth coverage of the Tech B2B ecosystem. The team is tasked with tracking the latest trends and developments across the tech industry, with a strong focus on emerging technologies and innovations. They are responsible for creating insightful editorial content, managing event coverage, and conducting research on new breakthroughs shaping the industry. TVP Bureau also plays a key role in ensuring that The Volt Post remains a trusted resource by staying ahead of the curve in reporting real-time news, views, and strategic industry insights

Exclusive Content

Teledyne FLIR Secures Industry-First UL 2684 Listing for Thermal Fire Detection Cameras

Teledyne FLIR has landed an industry-first UL 2684 listing...

Renesas Debuts Industry-First Dual-Side Cooled 650V GaN

Renesas Tackles AI Data Center Heat with Industry-First Dual-Side...

Kosuke Akiyoshi Tapped to Lead Panasonic Industry Europe as Spatz Retires

Panasonic Industry Europe is undergoing a major leadership transition....

BOS Semiconductors Joins Arm Ecosystem to Scale Custom Silicon for Physical AI

BOS Semiconductors has joined the Arm Total Design for...

NX Group with ISM to Overhaul India’s Chip Supply Chain Logistics

IPPON EXPRESS HOLDINGS, INC. signed a memorandum of understanding...

Navitas Lands ALATTIS Contract to Bridge Critical U.S. Supply Gap in 10 kV SiC Tech

With the ALATTIS program underway, Navitas will now build...

EQONIC Confirms Aluminium Battery Core

The company also says its aluminium-based chemistry and architecture is inherently non-flammable, removing the thermal runaway risk linked to many battery fires in conventional...

Kioxia, SanDisk Set New QLC Density Record

Kioxia and SanDisk have unveiled their next-gen QLC 3D flash memory technology, saying it delivers up to a 60% increase in bit density over...

DigiKey Adds 27K+ Stocking Products in Q2, Expands Supplier Base by 104

DigiKey in Q2 2026 added more than 27,000 new stocking products for fast shipment, bringing its total additions across the DigiKey system to more...

Dirac to Debut Spaces Automotive Audio Solution in U.S. at AES Detroit

Dirac will introduce Dirac Spaces to the U.S. market at the AES Automotive Audio 2026 International Conference, set for July 29-31 at Huntington Place...

BMW to Deploy NXP UWB for Digital Key Plus, Presence Detection

NXP Semiconductors said its Trimension NCJ29D6 family will be used in BMW Group vehicles, starting with selected 2026 model programs. The move is part of...

Silicon Labs Rollsout its Lowest-Power BLE SoC for Next-Gen IoT Devices

Silicon Labs has introduced the BG2B, the latest addition to its Series 2 portfolio of BLE wireless SoCs, targeting a new class of battery-powered...

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