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TVP Bureau is The Volt Post’s internal Editorial Team, dedicated to providing in-depth coverage of the Tech B2B ecosystem. The team is tasked with tracking the latest trends and developments across the tech industry, with a strong focus on emerging technologies and innovations. They are responsible for creating insightful editorial content, managing event coverage, and conducting research on new breakthroughs shaping the industry. TVP Bureau also plays a key role in ensuring that The Volt Post remains a trusted resource by staying ahead of the curve in reporting real-time news, views, and strategic industry insights

Exclusive Content

MIT Optical Bumps Push Chips to Petabit Speeds

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MIT researchers are betting that the next leap in...

Wi-SUN FAN Ratified as First ISO/IEC Wireless Mesh Networking Standard

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The Wi-SUN Alliance has announced that its Field Area...

Polymatech Commissions Sapphire Crystal-Growth Puller at Oragadam

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Polymatech Electronics has commissioned a sapphire ingot crystal-growth puller...

Danisense Appoints Hjalti Pall Thorvardarson as COO to Drive Global Growth

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Danisense has appointed Hjalti Pall Thorvardarson as Chief Operating...

Gyre Energy Raises $1.3Mn for AI-Driven Cooling

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Gyre Energy has secured more than $1.3 million in...

AI Servers Are Driving High-End MLCCs Toward a Looming Shortage

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AI servers are now the main engine behind a...
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ELCINA EMC Bhiwadi Targets 2,700 Jobs with ESSCI-Led Training Initiatives

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As India accelerates its push to become a global electronics and semiconductor manufacturing hub, building a skilled workforce is becoming just as critical as...
ELECTRONICS

Fujifilm Debuts PFAS-Free PBO for Semiconductor Packaging at ECTC 2026

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FUJIFILM Corporation announced it will unveil new semiconductor packaging research findings and showcase its ZEMATES™ product line of photosensitive insulating materials including PFAS-free PBO...
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Entegris and Inpria Cross-License EUV Lithography Patents

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Entegris and JSR Corporation, the materials innovation company and parent of Inpria Corporation, have announced a non-exclusive cross-licensing agreement designed to help the semiconductor...
DATA CENTER

Microchip’s 3.3kV mSiC Modules Power Next-Gen AI Data Centers

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Microchip Technology just unveiled its new 3.3 kV HV-D3 mSiC power modules, a game-changer for solid-state transformers (SSTs) in AI hyperscale data centers and...
ELECTRONICS

HMS Anybus Communicators Become CRA-Ready for EU Cybersecurity

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HMS Networks just made life a lot easier for industrial manufacturers dealing with the EU Cyber Resilience Act (CRA). Its Anybus Communicators are now...
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MIKROE Debuts Stepper 29 Click for Smarter, Smoother Motor Control

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Stepper 29 Click is MIKROE’s latest addition to its lineup of motor control Click boards, designed to simplify and accelerate embedded development. Built for...
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