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TVP BUREAU

TVP Bureau is The Volt Post’s internal Editorial Team, dedicated to providing in-depth coverage of the Tech B2B ecosystem. The team is tasked with tracking the latest trends and developments across the tech industry, with a strong focus on emerging technologies and innovations. They are responsible for creating insightful editorial content, managing event coverage, and conducting research on new breakthroughs shaping the industry. TVP Bureau also plays a key role in ensuring that The Volt Post remains a trusted resource by staying ahead of the curve in reporting real-time news, views, and strategic industry insights

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OMNIVISION Debuts Ultra-Thin OVMed Modules for Single-Use Endoscopes

ELECTRONICS VOLT TEAM - 0
OMNIVISION has introduced a new range of OVMed ultra-thin,...

NeoMesh USB Gateway Wins Product of the Year 2026

VOLT IN VOLT TEAM - 0
NeoCortec has congratulated its distribution partner, Endrich Bauelemente Vertriebs,...

The energy transition is not a power generation challenge. It is a grid challenge.

SUSTAINABILITY VOLT TEAM - 0
For years, the global energy debate has focused on...

Silicon Labs and Signify Bring Dual-Protocol Support to Philips Hue

ELECTRONICS VOLT TEAM - 0
By using Silicon Labs’ MG26 and SiMG301 wireless SoCs,...

Littelfuse Launches TX00AS314TRA Omnipolar TMR Sensor

ELECTRONICS TVP BUREAU - 0
Littelfuse has introduced the TX00AS314TRA Omnipolar TMR Switch Sensor,...

ST Launches VL53L9 ToF LiDAR for Robotics and AI Sensing

ELECTRONICS TVP BUREAU - 0
STMicroelectronics has introduced the VL53L9, a compact direct ToF...
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ASE Expands Advanced Packaging Capacity Buys Win Semiconductor Facility

TVP BUREAU -
ASE (Advanced Semiconductor Engineering) is set to significantly boost its advanced packaging operations by acquiring a production plant and associated facilities from WIN Semiconductors....
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NTT DATA with Google Cloud to Accelerate Agentic AI Adoption

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To speed up AI-powered cloud innovations and open up new opportunities with AI for enterprise companies across industries, NTT DATA announced a global cooperation...
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R&S Help Develop Dual-Function Satellite Test Solution for TASA

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The first integrated testing solution for the Taiwan Space Agency (TASA) was developed by Rohde & Schwarz in an effective partnership, allowing for seamless EMC...
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WLAN Trends and Challenges in 2025

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Wireless Local Area Networks (WLAN) have become the backbone of modern connectivity, enabling everything from home streaming to mission-critical industrial operations. In 2025, WLAN...
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Fourth Annual SPIE Photonics Industry Summit Returns This September

TVP BUREAU -
The fourth annual Photonics Industry Summit will be held in Washington, DC, by SPIE, the international society for optics and photonics. High-level members from...
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SuperSiC New Wafer Manufacturing Hub in Penang to Focus on SiC Wafers

TVP BUREAU -
SuperSiC (Malaysia) Sdn. Bhd., a subsidiary of Zhejiang Jingsheng Mechanical & Electrical Co. (JSG), has officially broken ground on a major new manufacturing facility...
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