Foxconn’s EV Manufacturing Model To Rejig Japan’s Auto Industry
A global leader in electronics manufacturing, is transforming Japan’s auto sector with its groundbreaking EV Manufacturing Model. This innovation is poised to reshape traditional...
R&S, NVIDIA Achieve New Milestone in AI-Driven Wireless Communication Research
A major advancement in AI-driven wireless communication research has been achieved by Rohde & Schwarz and NVIDIA. The most recent proof-of-concept, which will be on...
650V GaN HEMT that ROHM Designed in TOLL Packaging
ROHM Unveils 650V GaN HEMT in TOLL Package: A Breakthrough in Power Efficiency
650V GaN HEMT in TOLL package is the latest innovation from ROHM,...
Intel Breaks Barriers: 30,000 Wafers Processed With Advance High-NA EUV Tech!
Intel Leads Semiconductor Innovation with High-NA EUV Lithography. Intel High-NA EUV Lithography Achieves Major Milestone with 30,000 Wafers Processed.
Intel High-NA EUV lithography has reached...
Well-Known Jim Keller Joins ex-Intel’s RISC-V Front Startup
RISC-V collaboration is making waves in the semiconductor industry as Jim Keller well-known chip architect joins AheadComputing, a startup founded by ex-Intel engineers.
This new venture is...
QS7001 Quantum-Resistant Chip: A Breakthrough in Data Security
Protecting Data from Quantum Computing Attacks
The SEALSQ QS7001 quantum-resistant chip is set to revolutionize cybersecurity by shielding sensitive data from future quantum computing threats.
Developed...
