SEEPEX Easy Maintenance Macerator Launched
For many years, SEEPEX has used razor-sharp macerators to consistently shred solids and fibrous materials into the smallest particles in order to optimize the...
Is This India’s 3D SiP Revolution for Satellite Payloads?
izmo declared that a high-complexity 3D successfully System-in-Package (SiP) module for Space Payload Camera Electronics has been designed by its specialist division, Izmo Microsystems. This...
SEALSQ, Kaynes Seal India’s Post-Quantum Chip Future with JV
In order to create SEALKAYNESQ Ltd., a Joint Venture ("JV") in India, SEALSQ-Kaynes SemiCon established a final, binding agreement. The goal of the joint...
PCIM Asia New Delhi Concludes Uniting 550+ Leaders in Power Electronics
In India, the PCIM Asia New Delhi Conference made a spectacular debut. With over 550 participants from industry, 89% from academia, and 11% from...
New VIAVI RF Viewer Brings AR to Wireless Network Testing
VIAVI Solutions announced the integration of RF Viewer, a new Augmented Reality (AR) solution, into its OneAdvisor 800 Wireless test platform. RF Viewer enhances...
Infineon, HL Klemove MoU To Drive Innovation in SDV Architecture
A Memorandum of Understanding (MoU) has been struck by Infineon and HL Klemove to enhance their strategic partnership in automotive technologies. In order to...