indie Adds Advanced Optical Component Integration Capabilities
With the addition of in-house photonics integration, packaging, and system testing capabilities, indie Semiconductor expanded its photonics portfolio.
With the help of the most...
Mitsubishi Electric Expands Capacity of Power Module Assembly
At its Power Device Works in Fukuoka Prefecture, Japan, Mitsubishi Electric Corporation said it would invest around 10 billion yen to build a new...
FreeRTOS Support Now in Infineon AURIX TC3x MCU
Infineon Technologies AURIX TC3x microcontrollers (MCUs) now support FreeRTOS. One essential software that operates on the microcontroller is called a Real-Time Operating System (RTOS), which...
Synopsys, SEMIFIVE to Help Companies Adopt Multi-Die Designs for HPC
Recently, SEMIFIVE and Synopsys announced their partnership to create a state-of-the-art high-performance computing (HPC) platform that combines SEMIFIVE's CPU chiplet with an external I/O...
Microchip CEO Steps Down, Chairman Sanghi Takes Charge
Ganesh Moorthy, the CEO of Microchip Technology, will leave its position after three years, and Chairman Steve Sanghi will take over.
According to a statement released...
DDR5 Server MRDIMMs Now Has Complete Memory Interface Chipset Solution
The first complete memory interface chipset solutions for the second-generation DDR5 Multi-Capacity Rank Dual In-Line Memory Modules (MRDIMMs) have been supplied by Renesas Electronics...