AKM, SAL Completes PoC of eFuse Tech with SiC Power Devices
The European research center for electronics and software-based systems research, Silicon Austria Labs GmbH (SAL), and Asahi Kasei Microdevices Corporation (AKM) have successfully finished...
element14 Adds Range of 3D Printer Filaments of Multicomp Pro
To further serve the varied needs of designers, makers, and enthusiasts, element14 is adding a range of 3D printer filaments to its lineup of...
Newly Designed Pixel-Upgraded FSI, BSI Image Sensors
Two new image sensors have been added by OMNIVISION to its extensive family of solutions for security surveillance camera systems for consumers and industrial purposes.
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Latest Developments in VLSI Discussed at Supreme Knowledge Foundation
"Navigating the Silicon World: Exploring Contemporary Trends in the Semiconductor Industry and Crafting Your Career Path in VLSI" was the recent theme for an...
Samsung Union Wants Major Leadership Change Calls Strike in June
On June 7, the Samsung Electronics union will declare the start of its first-ever business strike, which could cause disruptions to the worldwide semiconductor...
eInfochips Expands Silicon Engineering Services Joins TSMC DCA Program
Announcing its membership in the TSMC Open Innovation Platform (OIP) Design Center Alliance (DCA), eInfochips, an Arrow Electronics firm, made the announcement.
With the...