USB PD New Specs and USB Power-Transfer Capability
The USB PD specification increased the fixed-voltage levels from the standard 5 V shared with USB 2.0 to 20 V, greatly enhancing the USB...
build3 Cohort 2 of Impact Startup Academy Announced!
Cohort 2 of build3's Impact Startup Academy (ISA) was revealed. The second cohort of the ISA, which starts on Monday, November 25, closely adheres...
Sondrel Bags Multi-Million Dollar Design Deal, To Develop HPC Chip
For a significant new customer, Sondrel has stated that it has begun front end, RTL design, and verification work on a high-performance computing (HPC) chip...
PIWOT: PanIIT World of Technology Congregates Magnetic Tech Leaders
The "PanIIT World of Technology Summit," an international gathering devoted to utilizing innovation for constructive social effect, is proudly presented by Pan IIT Alumni...
indie Adds Advanced Optical Component Integration Capabilities
With the addition of in-house photonics integration, packaging, and system testing capabilities, indie Semiconductor expanded its photonics portfolio.
With the help of the most...
Mitsubishi Electric Expands Capacity of Power Module Assembly
At its Power Device Works in Fukuoka Prefecture, Japan, Mitsubishi Electric Corporation said it would invest around 10 billion yen to build a new...