Synopsys, SEMIFIVE to Help Companies Adopt Multi-Die Designs for HPC
Recently, SEMIFIVE and Synopsys announced their partnership to create a state-of-the-art high-performance computing (HPC) platform that combines SEMIFIVE's CPU chiplet with an external I/O...
Microchip CEO Steps Down, Chairman Sanghi Takes Charge
Ganesh Moorthy, the CEO of Microchip Technology, will leave its position after three years, and Chairman Steve Sanghi will take over.
According to a statement released...
DDR5 Server MRDIMMs Now Has Complete Memory Interface Chipset Solution
The first complete memory interface chipset solutions for the second-generation DDR5 Multi-Capacity Rank Dual In-Line Memory Modules (MRDIMMs) have been supplied by Renesas Electronics...
ST Circles Around Sustainable Growth – Outlines 2027-28 Financial Model
Today in Paris, France, STMicroelectronics is celebrating Capital Markets Day. ST is restating its goal of generating over $20 billion in sales and the...
Continental’s Acclaimed ‘Transparent Tech’ to Get ‘Opaque’ at CES 2025
At the Consumer Electronics Show (CES) in Las Vegas (January 7–10, 2025), Continental will showcase a new display novelty that was recently recognized as...
Same Sky New USB 2.0 Type C Connectors in Compact Packages
Same Sky Interconnect Group announced that a number of new types that adhere to the USB 2.0 standard have been added to its lineup...