R&S 5G Conformance Test System First to Meet TPAC from GCF
After the Rohde & Schwarz R&S TS8980FTA-M1 5G conformance test system was approved as the first to meet test platform approval criteria (TPAC), the...
SambaNova Solve DeepSeek’s Biggest Challenge: Inference at Scale
DeepSeek-R1 671B is now operating on SambaNova Cloud at 198 tokens per second (t/s), reaching speeds and efficiency that no other platform can match,...
Infineon CoolGaN G3 Transistor in New Silicon-Footprint Packages
The highest performance levels in power electronics are made possible by gallium nitride (GaN) technology. But up until now, GaN providers have approached package...
ASE Builds Fifth Chip Packaging and Testing Facility in Malaysia
ASE has officially launched its fifth plant in Penang, which will significantly build on the company’s strong packaging and testing capabilities in the Bayan...
Synopsys Enhanced HAV portfolio with New HAPS Prototyping and ZeBu Emulation
Synopsys announced the expansion of its industry-leading hardware-assisted verification (HAV) portfolio with new HAPS prototyping and ZeBu emulation systems using the latest AMD Versal...
Blue Green Economy – Roadmap towards Sustainability
Like many innovative ideas, the concept of the Blue Green economy has no specific origin or author. It has been partly born out of...