GF Intends Advanced Packaging and Photonics Center in New York
Within its manufacturing plant in New York, GlobalFoundries (GF) announced intentions to establish a new center for advanced packaging and testing of key chips...
Common Criteria EAL5+ Certification for SEALSQ MS600X Secure Hardware Platform
The Common Criteria EAL5+ Certification, one of the highest globally recognized security certification levels for hardware devices, has been granted to SEALSQ's MS600X Secure...
With CMUT, Infineon’s Maiden Integrated One-chip Solution for MEMS-Based Ultrasonic Transducer
The technology for capacitive micromechanical ultrasonic transducers (CMUT) has advanced significantly, as affirmed by Infineon Technologies in its official release. The company can produce...
Marubun to Introduce LTSCT in the Japanese Market, Inks MoU
In order to promote L&T Semiconductor Technologies Limited's (LTSCT) product development and market demand research in the Japanese market, Marubun Corporation and LTSCT have...
Infineon’s New Business Unit, SURF Merges Sensor, RF Biz
By merging the current Sensor and Radio Frequency (RF) businesses into a single, specialized organization, Infineon Technologies announced the creation of a new business...
Samsung Electro-Mechanics, Soulbrain to Create Glass Substrates for AI Chips
In order to create materials for glass substrates, a crucial part of next-generation artificial intelligence (AI) chips, Samsung Electro-Mechanics has formed a strategic relationship...