IEEE Wintechcon 2025: Women Power India’s Semicon Innovation
Over 800 women engineers, technologists, business executives, academics, students, and researchers came together for the sixth edition of IEEE WINTECHCON 2025. The conference, which took...
A new way we connect with ourselves and the world
In today’s fast-paced world, staying connected with your body and understanding its performance is key to achieving personal goals, whether in fitness, sports, hobbies,...
Cadence Acquires ChipStack to Accelerate AI Chip Design
Cadence Design Systems has announced the acquisition of Seattle-based startup ChipStack, a move aimed at accelerating chip design automation through advanced AI technology.
ChipStack specializes...
Cyient, SIDBI Launch AI Skills Center in Nagaland
The establishment of an AI & Future Skills Center of Excellence (CoE) at the Nagaland Tool Room & Training Centre (NTTC), Dimapur, was announced...
Rohde & Schwarz, Samsung Lead 5G NR-NTN Breakthrough
By successfully validating the first NR-NTN test cases in accordance with 3GPP Release 17 test specifications for RF, RRM, and PCT, Rohde & Schwarz,...
LEMO Unveils Next-Gen REDEL SP IP68 Connectors
The REDEL SP IP68 Series, the next-gen of high-performance connectors designed for medical, test and measurement, and UAV applications, has been introduced by LEMO.
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