Teledyne FLIR OEM New Boson+ IQ Thermal Imaging Development Kit
The Boson+ IQ Development Kit announced by Teledyne FLIR OEM, a division of Teledyne Technologies Incorporated. The all-inclusive solution enables integrators to quickly create...
Meet The Industry’s Most Customizable High-Voltage Reed Relay
The Series 600 is Pickering Electronics' most customizable range of high voltage reed relays to date, with over 2500 possible rating and connection options. In...
VVDN Technologies, QNX Partners for Mission-Critical Products
VVDN Technologies and QNX announced their partnership. By collaborating, QNX and VVDN are enabling customers in the automotive, industrial, medical, aerospace and defense, and other...
Vero’s Range of PCB Prototyping at Anglia Components
A wide variety of PCB prototyping tools and accessories from the UK company Vero Technologies Ltd. are now available at Anglia Components. Protoboards, backplanes,...
Infineon, Kaynes Semicon Inks MoU to Tap India’s Growing Semi Market
A Memorandum of Understanding (MoU) has been signed by Kaynes Semicon and Infineon to explore potential strategic partnerships in India's rapidly expanding semiconductor market.
Strengthening India’s...
Farnell To Stock Pulsiv OSMIUM Products and Major Product Portfolio
Farnell, a major distributor of electronic components and Pulsiv have inked a global stocking agreement. Due to this significant agreement, Pulsiv's evaluation boards, microcontrollers,...