Advanced VOC Camera Buffers Events with High Security
Using a variety of trigger options, including software, hardware, or motion inputs, the VOC event camera allows for event-driven recordings up to 900 seconds...
Elektrobit Unveils Scalable SDV Innovations at CES 2026
Elektrobit will demonstrate how its E/E architecture solutions and award-winning automotive software expertise allow OEMs to produce innovative, connected vehicles that are the ideal size...
Pickering 12-Slot LXI/USB Modular PXI Chassis for Scalable Test Systems
The 60-107-001 is a new compact 12-slot LXI/USB modular chassis from Pickering Interfaces. With 12 hybrid-compatible slots in a 2U form size, this chassis...
Everspin Debuts High-Reliability EMxxLX HR MRAM
The EM064LX HR and EM128LX HR devices are Everspin Technologies' latest high-reliability additions to the PERSYST MRAM product range. For aerospace, defense, automotive, and...
ST Unveils STM32V8, Its Fastest 18nm MCU Powering SpaceX Starlink
STMicroelectronics has unveiled the STM32V8, a new generation of high-performance microcontrollers (MCUs) for demanding industrial applications. The STM32V8 MCU is designed with ST’s most...
Hikrobot Launches 3D Laser Profile Sensor in India
Recently, Hikrobot launched the 3D Laser Profile Sensor in India for a variety of use cases. It is anticipated to significantly boost the PCB,...