Teledyne FLIR Launches Lepton XDS Dual Thermal Camera
Teledyne FLIR OEM Introduces Lepton XDS Dual Thermal and Visible Camera Module.
Teledyne FLIR OEM has unveiled the Lepton XDS, a compact dual thermal and...
Infineon Brings AI-Ready MCUs, XENSIV Sensors to embedded world 2026
At embedded world 2026, Infineon will highlight its XENSIV sensor portfolio and demonstrate how advanced sensor data underpins advanced automotive, industrial, and consumer applications.
Next-generation...
Automation Anywhere, AI Kiran to Train 1 Million Indians in AI
Automation Anywhere has teamed up with AI Kiran to train one million people in AI skills by 2030, with a special focus on empowering women and young...
Teledyne Unveils TDLNA0840EP, Lowest-Power 4GHz LNA
Teledyne HiRel Semiconductors just unveiled the TDLNA0840EP, a game-changing ultra-low-power, wideband low-noise amplifier (LNA) that hits up to 4.0 GHz while sipping just tens of milliwatts from a single 1.5V...
NeoCortec Unveils NeoGW 2.0 with MQTT at Embedded World 2026
At Embedded World 2026 (March 10-12 in Nuremberg, Germany), NeoCortec will unveil the next-gen NeoGW.
This open-source, multiplatform gateway software makes it easy to connect...
MIKROE Unveils EnOcean 5 Click for Effortless Wireless Prototyping
MIKROE has introduced the EnOcean 5 Click, a new wireless connectivity Click board™ designed to streamline communication with EnOcean-based sensors, switches, and actuators. As part...