Is Kioxia’s Latest Breakthrough Ready For High-Density AI DRAM
The development of highly stackable oxide-semiconductor channel transistors, which would make high-density, low-power 3D DRAM feasible by Kioxia Corporation. This technology, which was introduced at...
MIKROE Launches CAN-LIN SBC Click for Dual Protocol Communication
CAN-LIN SBC Click is a new Click board communication interface by MIKROE. Developers can quickly develop proof-of-concept, prototype, and code new embedded solutions with...
Anritsu, HEAD Acoustics Enable Next-Gen eCall Voice Quality Evaluation
In partnership with HEAD Acoustics, ANRITSU CORPORATION announced the release of an advanced acoustic evaluation solution for next-generation vehicle emergency call systems ("NG eCall").
Faster and...
GlobalFoundries Names Sam Franklin as New Chief Financial Officer
Sam Franklin has been named Chief Financial Officer by the Board of Directors of GlobalFoundries (GF), with immediate effect. Prior to his current position...
USB-IF Validates Anritsu MP1900A Solution for USB4 Version 2.0 Compliance Testing
The USB Implementers Forum (USB-IF) has validated ANRITSU CORPORATION's test solution for the most latest USB4® Version 2.0 (USB4 v2) communication standard. This...
Renesas’ Dual-Band Wi-Fi 6, Bluetooth LE MCUs for IoT Applications
The RA6W1 dual-band Wi-Fi 6 wireless microcontroller (MCU) and the RA6W2 MCU, which combines Bluetooth Low Energy (LE) and Wi-Fi 6, were released by...