Texas Instruments (TI) expanded its extensive Arm® Cortex®-M0+ MSPM0 MCU range, the company has introduced the said most compact MCU in the world. The wafer chip-scale package (WCSP) for the MSPM0C1104 MCU, which is only 1.38mm2 in size—roughly the size of a black pepper flake—allows designers to maximize board space in applications like personal electronics and medical wearables without sacrificing performance.
TI’s MSPM0 MCU range, which includes more than 100 affordable MCUs, provides scalable on-chip analog peripheral topologies and a variety of computing choices to improve embedded designs’ sensing and control capabilities.
These devices will be on display at TI’s embedded world 2025 in Nuremberg, Germany, from March 11–13.
More Compact Package at a Cheaper Price
Consumers are always requesting that commonplace electronic devices, such stylus pens and electric toothbrushes, provide more functionality in a more compact package at a cheaper price.
Engineers are increasingly looking for small, integrated components that allow them to add functionality while maintaining board space in order to innovate inside these smaller devices.
The MSPM0C1104 MCU makes use of TI’s cost optimization initiatives, deliberate feature selection, and the benefits of WCSP packaging technology. With a dimension of 1.38mm2, the eight-ball WCSP is 38% smaller than similar devices.
The MCU has six general-purpose input/output pins, a 12-bit analog-to-digital converter with three channels, 16KB of memory, and compatibility with common communication interfaces like the Serial Peripheral Interface (SPI), Inter-Integrated Circuit (I2C), and Universal Asynchronous Receiver Transmitter (UART).
Engineers may preserve the computational performance of their embedded systems without expanding the board size by incorporating precise, fast analog components into the smallest MCU in the world.
Leadership Comments
“In tiny systems such as earbuds and medical probes, board space is a scarce and valuable resource,” said Vinay Agarwal, vice president and general manager of MSP Microcontrollers at Texas Instruments (TI). “With the addition of the world’s smallest MCU, our MSPM0 MCU portfolio provides unlimited possibilities to enable smarter, more connected experiences in our day-to-day lives.”
For more information, see ti.com/MSPM0C1104.
To learn more, read the technical article, “Tiny, but mighty: How small-size packaging and integration for MCUs help optimize space-constrained designs.”
Scale from small to large designs using a single MCU portfolio
TI’s MSPM0 MCU portfolio, which combines scalability, cost optimization, and user-friendliness to speed time to market, is joined by the new MSPM0C11004 MCU. To meet memory, analog, and computing requirements in personal electronics, industrial, and automotive applications, Texas Instruments MSPM0 MCU range offer pin-to-pin compatible packaging configurations and feature sets.
The portfolio includes other compact packages to help minimize board size and bill of materials, with prices starting at US$0.16 in 1,000-unit quantities. Engineers may create products of any size while lowering the cost and complexity of their systems thanks to this portfolio-wide optimization and feature integration.
An optimized software development kit for all MSPM0 MCUs, a hardware development kit for quick prototyping, reference designs, and subsystems—code samples for typical MCU operations—are all part of TI’s extensive ecosystem for additional support.
Without knowing any code, users may create, setup, and execute MCU programs in a matter of minutes with TI’s Zero Code Studio tool. This ecosystem allows engineers to reuse code and scale systems without requiring major changes to hardware or software. In addition to this ecosystem, TI’s increasing investments in internal manufacturing capacity to meet future demand underpin the MSPM0 MCU line.
TI at embedded world 2025
At embedded world 2025, TI will demonstrate how its technologies enable engineers to reimagine embedded systems, helping create a more intelligent and connected world. TI’s exhibit in Hall 3A, Booth No. 131 will include advancements in real-time monitoring and perception with edge artificial intelligence, connectivity for the Internet of Things, and development with open-source software. See ti.com/EW for more information.
Highlights during the show include:
- Tuesday, March 11:
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- TI Chief Technology Officer Ahmad Bahai, Ph.D., participates in “C-Level @ embedded world.”
- Nitika Verma presents “Network Traffic Tunneling on Heterogeneous SoCs.”
- Wednesday, March 12:
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- Daolin Qiu presents “Time Synchronization over Network Redundancy in Real-Time Applications.”
- Thursday, March 13:
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- Nilabh Anand presents “Audio Solutions with TSN – Architecture for Zonal Automotive ECUs.”
- Divyansh Mittal presents “Boot Time Optimization for Early Display and Graphics in Embedded Systems.”
- Matthieu Chevrier and Ahmad Saad, Ph.D., MathWorks, present “Faster Time to Market, Effective mmWave Radar Prototyping: A Unified Approach with TI MMIC and MATLAB.”
- Nilabh Anand presents “Benchmarking Network Startup Time for Security-Enforced Industrial IoT Devices.”
Package, availability and pricing
Preproduction quantities of the MSPM0C1104 MCU are available at TI.com.
- Pricing of the WCSP device is US$0.20 in 1,000-unit quantities.
- Multiple payment and shipping options are available.
- The MSPM0C1104 LaunchPad™ development kit is available for US$5.99 on TI.com.
