StratEdge Corporation announces that it will be showcasing its latest advancements in high-temperature packaging technology at the iMAPS HiTEC Power Packaging Conference, which takes place April 14–17 in Albuquerque, NM, and at the Components for Military & Space Electronics (CMSE) event, which runs from April 29–May 1 in Los Angeles, CA at Booth B20.
StratEdge’s molded ceramic packages provide unsurpassed reliability and are intended to handle high-frequency chips up to 18 GHz. There are over 200 standard outlines available, allowing a wide range of packaging possibilities. Many open-tooled designs have 50 ohm impedance high-frequency transitions, making it convenient and easy to package high-performance semiconductors.
StratEdge’s packages are designed to provide optimal reliability in power and RF applications under harsh environments. Its molded ceramic packaging solutions provide strong thermal dissipation and high-frequency performance.
StratEdge’s packages are built for maximum reliability in power and RF applications under extreme conditions. Its molded ceramic packaging solutions offer robust thermal dissipation and high-frequency performance.
According to Casey Krawiec, VP of Global Sales at StratEdge, “Our molded ceramic packages are extremely popular where devices encounter harsh environments. Testing has shown they can withstand extended exposures at over 500°C, which is why they’re selected for automotive, down-hole, jet engine, and other high-temperature applications, as well as traditional uses in space and defense.”
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