At the forthcoming Mobile World Congress in Barcelona, Rohde & Schwarz and NXP Semiconductors will showcase a test setup for UWB radar target simulation.
Being the first of its kind, the demonstration confirms the NXP Trimension NCJ29D6A chipset’s exceptional performance, including the improved radar algorithms. Maximum control and reproducibility of the simulated situation are made possible by its ability to generate UWB radar targets with a variable target distance as low as a few centimeters.
Because of its accurate and safe range capabilities, Ultra-Wideband (UWB) technology is rapidly expanding in the automotive, mobile, and Internet of Things sectors.
According to the Car Connectivity Consortium (CCC), the Digital Key uses UWB to provide hands-free, safe, and convenient automobile entry without sacrificing security. New UWB-radar application cases, like kick-sensing for convenient trunk access, intrusion or proximity detection, Child Presence Detection (CPD), and many more, are made possible by the current generation of NXP Trimension UWB chipsets.
Advanced target simulation helps these UWB radar applications overcome technical obstacles, such as huge signal bandwidth and short-range target modeling, to name just two. The R&S FSW26 spectrum analyzer, R&S SMW200A signal generator, and R&S-developed control software are the essential parts.
The initial capital outlay is decreased because the equipment is currently available in UWB engineering facilities. For Tier1s, car OEMs, UWB chipset suppliers, and module providers, the demonstration is particularly intriguing.
Leadership Comments
An integral part of this demonstration setup is NXP’s TrimensionTM NCJ29D6A, which is the first monolithic UWB chipset that combines secure ranging and short-range radar with an integrated MCU to enable use cases such as CPD, kick-sensing, and intrusion detection. “The demonstrator from Rohde & Schwarz allows our customers to validate their UWB radar systems and algorithms to shorten development cycles and optimize time-to-market,” said Michael Leitner, General Manager Secure Car Access, NXP Semiconductors. “This collaboration with Rohde & Schwarz is another milestone contributing to the success of UWB technology in the automotive market.”
In order to support the automotive ecosystem in testing these new use cases, collaboration with key partners is especially important. Rohde & Schwarz and NXP Semiconductors have worked closely together to validate this test system. Jürgen Meyer, Vice President Automotive Market Segment at Rohde & Schwarz remarked, “We greatly appreciate the close working relationship with the NXP Semiconductors teams around the world to realize this unique demonstration to provide the automotive industry with the test capabilities it needs to enable the next wave of UWB applications.”
The test setup will be shown at the Mobile World Congress in Barcelona, from the March 3 to March 6, 2025, at the Fira Gran Via, in Hall 5, booth 5A80.
