Infineon Technologies is launching the E-version of its hybrid flyback controller family after the industry’s first PFC and hybrid flyback (HFB) combo IC was introduced to the market.
The new XDP hybrid flyback digital controller family, which is intended for high-performance applications, makes use of the sophisticated asymmetrical half-bridge (AHB) topology, which enables high power density designs by fusing the effectiveness of a resonant converter with the simplicity of a flyback converter.
The controllers are therefore perfect for a wide range of AC/DC applications, such as OEM and aftermarket chargers, power tools, adapters, e-bike chargers, industrial switching power supplies, TV power supplies, and LED drivers.
Compared to LLC resonant converters and active clamp flyback (ACF), the hybrid flyback architecture has a number of benefits. It results in a reduced transformer size by reducing magnetic energy storage and operating with lower leakage inductance.
For compliance with Department of Energy (DoE) 7 and Certificate of Conformity (CoC) Tier 2 requirements, HFB reduces idle power consumption, improves efficiency at low loads, and achieves high efficiency over a broad output range while minimizing power losses through multimode operation.
HFB is a good fit for small, effective power supply systems because of these features. The E-version of the hybrid flyback ICs further improves performance in power conversion applications with patent-pending improved PFC features, synchronized PFC and HFB start-up behavior, and optimization for the newest CoolGaN transistors.
Additionally, effective implementation in complex designs is supported by streamlined parameter configuration, a thorough design tool, and a design guide.
The ultra-slim 400 W power supply unit with over 97 percent efficiency for DC-DC voltage conversion, 120 W multiport charger solutions with outstanding standby and partial load efficiency, and an ultra-compact 140 W GaN charger are among the featured products.
Information on this technology will be available at the Infineon booth at 2025 APEC (March 16-20) in Atlanta, GA.
Further Info About E-Version XDP Hybrid Flyback Controller ICs from Infineon, Click Here.
