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Kyocera, R&S Present Characterisation of New mmWave PAAM Design for FR2
In order to guarantee optimal beam steering and beam directivity of their ground-breaking product, Kyocera uses CATR-based multi-reflector OTA testing technology from Rohde &...
Cambridge GaN Devices Raises Fund To Develop Next-Gen GaN Solutions
A $32 million Series C fundraising round was successfully closed by Cambridge GaN Devices (CGD). With involvement from British Patient Capital and backing from...
Emerson PAC Machine Edition 10.6 Released
PAC Machine Edition (PME) 10.6, an integrated development environment software for configuring and managing control system devices, such as QuickPanel human-machine interfaces (HMIs) and...
Same Sky Adds More Than 200 New SKUs to its AC Power Cords Line
More than 200 additional SKUs have been added to the Same Sky Interconnect Group's lineup of ac power cords. In addition to C5, C7,...
ROHM’s New Rollout Assist Adoption of CAN FD in Modern Automotive
Bidirectional TVS ESD protection diodes compatible with CAN FD (CAN with Flexible Data rate) high-speed in-vehicle communication, ESDCANxx series have been developed by ROHM. As...
How ‘Silicon Labs’ is Pulsating the IoT Boom in India – An Inside Story!
The Volt Post recently met Manish Kothari, Senior Vice President of Software Development and Head of Operations - India, SILICON LABS. The viz-a-viz was...
Altium, AWS India Aims to Equip a Generation With Skills, Industry Impact
Altium announces that it is collaborating with Amazon Web Services (AWS) India to transform tech education across India. They will introduce a unique curriculum...
R&S 5G Conformance Test System First to Meet TPAC from GCF
After the Rohde & Schwarz R&S TS8980FTA-M1 5G conformance test system was approved as the first to meet test platform approval criteria (TPAC), the...
SambaNova Solve DeepSeek’s Biggest Challenge: Inference at Scale
DeepSeek-R1 671B is now operating on SambaNova Cloud at 198 tokens per second (t/s), reaching speeds and efficiency that no other platform can match,...
Infineon CoolGaN G3 Transistor in New Silicon-Footprint Packages
The highest performance levels in power electronics are made possible by gallium nitride (GaN) technology. But up until now, GaN providers have approached package...
ASE Builds Fifth Chip Packaging and Testing Facility in Malaysia
ASE has officially launched its fifth plant in Penang, which will significantly build on the company’s strong packaging and testing capabilities in the Bayan...
