R&S, NVIDIA Achieve New Milestone in AI-Driven Wireless Communication Research
A major advancement in AI-driven wireless communication research has been achieved by Rohde & Schwarz and NVIDIA. The most recent proof-of-concept, which will be on...
650V GaN HEMT that ROHM Designed in TOLL Packaging
ROHM Unveils 650V GaN HEMT in TOLL Package: A Breakthrough in Power Efficiency
650V GaN HEMT in TOLL package is the latest innovation from ROHM,...
Intel Breaks Barriers: 30,000 Wafers Processed With Advance High-NA EUV Tech!
Intel Leads Semiconductor Innovation with High-NA EUV Lithography. Intel High-NA EUV Lithography Achieves Major Milestone with 30,000 Wafers Processed.
Intel High-NA EUV lithography has reached...
Well-Known Jim Keller Joins ex-Intel’s RISC-V Front Startup
RISC-V collaboration is making waves in the semiconductor industry as Jim Keller well-known chip architect joins AheadComputing, a startup founded by ex-Intel engineers.
This new venture is...
QS7001 Quantum-Resistant Chip: A Breakthrough in Data Security
Protecting Data from Quantum Computing Attacks
The SEALSQ QS7001 quantum-resistant chip is set to revolutionize cybersecurity by shielding sensitive data from future quantum computing threats.
Developed...
DigiKey Brings Qorvo’s RF, Power Semi Offerings to Global Customers
Qorvo and DigiKey announced a global distribution partnership. This partnership will increase Qorvo's high-performance solutions' visibility, accessibility, and delivery speed to customers worldwide.
Through the partnership...
