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TVP BUREAU

TVP Bureau is The Volt Post’s internal Editorial Team, dedicated to providing in-depth coverage of the Tech B2B ecosystem. The team is tasked with tracking the latest trends and developments across the tech industry, with a strong focus on emerging technologies and innovations. They are responsible for creating insightful editorial content, managing event coverage, and conducting research on new breakthroughs shaping the industry. TVP Bureau also plays a key role in ensuring that The Volt Post remains a trusted resource by staying ahead of the curve in reporting real-time news, views, and strategic industry insights

Exclusive Content

Pickering Series 120 Reed Relays Deliver Low Thermal EMF in High?Density Designs

Pickering Electronics has released new comparative test data showing...

Qualcomm and Amazon Expand Collaboration on AI Data Center Silicon

Qualcomm and Amazon are expanding their collaboration to develop...

Microchip Launches Low-Jitter Clock Buffers for AI and FPGA Systems

Microchip Technology has introduced the SY757xx family of 1.2V-output...

Shangjia Semiconductor Has Secured Fresh Funding

Chinese power semiconductor company Shangjia Semiconductor has secured fresh...

HCL Technologies Opens INR 185 Crore Semiconductor Lab in Bengaluru

HCL Technologies opened a INR 185 crore advanced semiconductor...

Samsung and Mistral AI Target Smarter Chipmaking

Samsung Electronics has entered into a strategic partnership with...

LITEON Takes 25% Stake in DCX Liquid Cooling for $176M

Taiwan’s LITEON Technology has made a strategic investment in Warsaw-based DCX POLSKA Sp. z o.o. (“DCX Liquid Cooling Systems”), securing roughly a 25% equity...

Flex to Acquire EPC Power in $4.4 Billion Deal

Flex has entered into a definitive agreement to acquire EPC Power for $4.4 billion, subject to customary adjustments, in a move that will strengthen...

FEMTO Brings Sovereign AI Infrastructure to India

KBE and Vigyanlabs Innovations Pvt. Ltd. officially launches FEMTO, an indigenous sovereign AI infrastructure platform, on September 5, 2026, at JSS College of Pharmacy...

Maxscend Expands Into Optical Interconnects Business

Maxscend Technologies is expanding beyond its core RF chip business and moving into optical interconnects, positioning silicon photonics and related technologies as new growth...

Baya Systems, AdoreSys to Advance Chip Design Across Asia-Pacific

Baya Systems and AdoreSys have announced a strategic partnership aimed at helping semiconductor and systems companies in China and the broader Asia-Pacific region tackle...

Inside L&T Tech’s New Deep-Tech Startup Acceleration Platform

L&T Technology Services has launched LTTS FARM, a startup engagement platform built to move deep-tech innovations from validated prototypes to real-world deployments faster. The...

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